TGV technology is a new vertical interconnection technology applied to the field of wafer level vacuum packaging; Owing to its excellent electrical properties, mechanical properties, airtightness and reliability, TGV technology is widely used in advanced 3D system packaging, high Q microwave/THz devices, optical/RF MEMS, microfluidic chips, new Micro LED substrates and other fields.
Hardware Parameters
Positioning accuracy: ≤±3μm
Repetition accuracy: ≤±1μm
Production capacity: 5000 point/s
Good compatibility, supporting the modification of different glass materials, including quartz, borosilicate, high aluminum, sodium calcium, etc.
Multiple forms and patterns, like round hole, square hole, buried hole, through-hole and micro-groove feasible on the substrate according to requirements.
Excellent deep hole characteristic, with depth-to-width ratio up to 50:1 and minimum pitch between holes ≤ 20μm.
Good hole quality and smooth side walls without cracks, chips, and stress.