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Test Research, Inc. (TRI)

Penang,  Malaysia
http://www.tri.com.tw
  • Booth: 3920

SEMI & Advanced Packaging Industry Inspection

Overview

Founded in 1989, Test Research, Inc. (TRI) is the World's leading brand in Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. Test Research, Inc. offers the most robust product portfolio in the industry for automatic test and inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D AXI systems to Manufacturing Defect Analyzers (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a wide range of manufacturing test and inspection requirements.

TRI provides Test and Inspection equipment for multiple electronics manufacturing, from Automotive, Medical, and Consumer electronics to Advanced Packaging & Semiconductor manufacturing. TRI's inspection solutions offer Smart Programming, Multiple 3D Technologies, Metrology measurements, and AI-Powered Algorithms.

TRI SEMI Inspection Functions
Die Bonding
Missing, Orientation, Rotation, Shift, Tilted, Chipping, Crack, Scratch, 
Bond line thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height
Wire Bonding
Broken, Short, Sweep/Sink, Missing, Sway, Collapse, Loop Height
Sagged Wire, Cross Wire Gap, Wire Tracing, Ball Bond Diameter
Ball Placement, Stitch Width, Stitch Coverage over Ball
Ball-off Pad, Ball touch Pad Distance, Clubbed Ball, Ball Thickness
Lifted Ball, Low Landing, Bond on Contamination
Bonding Area/Pad
Copper Protrusion, Crack, Chipping, Exposed Copper, Exposed Nickel, 
Target Material, Scratches or Brush Marks, Oxidation
Molding / Underfill Materials 
(EMC, CUF, NCP, NCF, MUF)
Area coverage, Dimensions, Surface, Void, Damage, Crack, Scratches, 
Delamination, Contamination, Surface particles
Patterned Wafer Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling,
Probe Mark Defect, CD Measurement
Bump Wafer 2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material, CD Measurement
Wafer Frame Chipping, Crack, Scratch, Particle, Contamination, CD Measurement, Saw 3D metrology

  Products

  • 3D AOI - TR7900Q SII
    • Advanced Package Defect Detection for Wire/Die Bonding down to 17 μm
    • 2.5 μm High-Resolution 3D AOI with AI and Metrology
    • Built-in Loader and Unloader for Magazine handling
    • Shortwave Infrared (SWIR) Lighting
    • Clean Room Class 1000...

    • The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MP imaging technology for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI fully integrates with the loader/unloader module to ease handling strips and magazines. The Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 17 μm (0.7 mil) wire diameters.

    TR7900Q SII - Inspection Functions

    Die Bonding

    Missing, Orientation, Rotation, Shift, Tilted, Chipping, Crack, Scratch, 

    Bond line thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height

    Wire Bonding

    Broken, Short, Sweep/Sink, Missing, Sway, Collapse, Loop Height,

    Sagged Wire, Cross Wire Gap, Wire Tracing, Ball Bond Diameter, 

    Ball Placement, Stitch Width, Stitch Coverage over Ball, Ball-off Pad, 

    Ball touch Pad Distance, Clubbed Ball, Ball Thickness, Lifted Ball,

    Low Landing, Bond on Contamination 

    Bonding Area/Pad

    Copper Protrusion, Crack, Chipping, Exposed Copper, Exposed Nickel, 

    Target Material, Scratches or Brush Marks, Oxidation
  • 3D SPI - TR7007Q SII-S
    • High Precision Inspection for Advanced Packaging Applications
    • Wide Spectrum Light for Enhanced Contrast and Detection Rate
    • Improved Accuracy and Stability for Precise Solder Measurements
    • Smart Board Warpage Compensation
    • Smart Factory solution...

    • The TR7007Q SII-S is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.

    Inspection Functions
    Applications  Bumps, Flux, Mini-LED Solder, Glue, Solder Paste
    Defects Detected Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste & Bridging
    Measurement  Height, Area, Volume and Offset

Categories

203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Package Inspection; Lead Scanners
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; Lexes Systems
    • 602 Manufacturing Software
  • Yield Management; Process Control Software
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