The autobagging tool: Fully automatic packaging of FOSBs
The packaging of wafers for transportation to a semiconductor plant (FAB) is a complex process and is subject
to the strictest criteria. We have fully automated the packaging process! Our AutoBagging Tool (ABT) significantly
increases throughput and offers a considerable increase in quality and safety during packaging. The
throughput is 3,000 to 8,000 FOSB/month (75k to 200k wafers/month).
The advantages at a glance:
• Increase in efficiency
• Significant reduction in the error rate
• Increase in quality
• Reduced workload for employees
• Usually no set-up time required
The packaging machine, the test chamber, the robots and all other components are placed in a complete cell.
This has an infeed conveyor for the unpackaged FOSBs and an outfeed conveyor for the packaged FOSBs. Various
checks (cross-slot, fill level, attachments) as well as labeling (including checking the print) and folding/
gluing the bags are carried out entirely in the ABT.
Numerous checks guarantee a safe packaging process:
• Cross-Slot-Check
• Attachment testing
• Checking all applied labels (quality and content)
• 100% Leak test