Advanced Dicing Technologies Ltd

Highest Dicing Process Speeds -  Lowest Cost

Low vibration Air spindle

Fast automatic alighnment and cut positionning for increased throughput

Automatic Kerf check and quality analysis for maximum precision

Process data logging and statistical analysis

• The dicer has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users
• The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories
• The core components of the entire machine are independently controllable and are not affected by global economic and political changes

• Standard configuration includes a 2.2kW high-speed spindle (torque: 0.42N · m, maximum rotational speed: 60,000rpm)
• Equipped with a 17-inch large-screen LCD touchscreen, featuring a user-friendly operating interface
• The θ-axis is driven by a direct drive (DD) motor, providing high rotational precision and resolution
• Fragment shape recognition feature
• It is a highly practical equipment capable of precision cutting of silicon wafers, PCB boards, ceramics, and other materials
• The equipment has a small footprint, which helps to save operating costs

• Confocal sensor
• Loading up to 4 QFN magazinesTapeless process
• Automatic loading 2 QFN panels (can support single panel)
• Brush deburring

• The equipment has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users.
• The core components of the entire machine are independently controllable and are not affected by global economic and political changes.

• Water recycling > Reducing consumption by 95%
• Efficient cooling system > Lowering power consumption
• Self-cleaning filter > Saving maintenance costs
• Reducing environmental impact