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DongGuan Haye Semiconductor Technology Co., Ltd

东莞市,  广东省 
China
http://www.dghaye.com
  • Booth: 1126

Welcome to Haye!

Overview

    Dongguan Haye Semiconductor Technology Co.,Ltd, a nationally recognized high-tech enterprise, excels in the design, manufacture, and sale of integrated circuit packaging and testing equipment. Currently employing over 500 individuals at its Dongguan headquarters, Haye also boasts of a team of more than 80 research and development professionals. With a factory spanning 20,000 square meters, Haye extends its operations to its East China office in Wuxi, Jiangsu Province, and R&D centers in Longhua District, Shenzhen and Hefei, Anhui Province. Emphasizing the importance of independent research and development, Haye possesses a sharp, high-end technology R&D team. Both its technology and products are at the forefront of the industry.
Abiding by the spirit of "rooted in integrity, dedicated to innovation," Haye.under the leadership and collective efforts of all employees, has garnered unanimous praise from clients since its product launch. Many renowned IC design and packaging and testing companies in China have already become our clients. Relying on technological innovation, meticulous production management, and a well-established after-sales service system, we strive to provide customers with cost-effective products and superior services.


  Products

  • TURRET HANDLER
    A high-precision and high-efficiency automation equipment integrating semiconductor chip testing, marking, sorting and packaging....

  • Model SHF8000 SHF8200 SHF8600
    Package SOT/SOD/SOP/QSOP/TSSOP/MSOP/
    TO252/TOLL/QFN/DFN/BGA/wlcsp
    DFN0603/DFN1006/DFN1010/
    SOD923/SOD723/SOD523
    TO-263/TO-220/TO-247
    UPH 35~50K Max50K 12~25K
    Test station Max 12sites Max 4sites Max 7sites
    Feeding Bowl feeder,Tube Bowl feeder,Tube Bowl feeder,Tube
    Receicing Tape,Tube Tape Tape,Tube
  • DIE BONDER
    A equipment used for the pre packaging process of semiconductor packaging, which is to paste a chip (wafer) onto a lead frame....

  • Model SHD8120
    Loading method Wafer stacking and tray
    Bonding method Epoxy
    Chip size 0.25mmx0.25mm~4mmx4mm,Thickness >75um
    Substrate size L: 100-300mm, W: 20mm-102mm, H:0.1-1mm
    Bonding precision X/Y:±20μm,Die size<1mm ±3°,≥1mm ±1°
    Bonding speed (UPH) Max 17K (variable depending on chip size and density of frame bonding)
    Wafer size 12 inches (compatible with 8 inches)
    Wire head rotation 0°~360°
    Wafer rotation 0°~360°
    Bonding pressure 30~500g
    MAP diagram Available
    DAF Optional(2 temperature zones)
    Dispensing method Double dispensing
    Painting Available
    Image recognition 256-level grayscale
    Resolution 640×480 pixels
    Recognition accuracy 0.25mil
    Power supply 220V/50Hz,Power approximately  1.6KW
    Compressed air ≥0.4Mpa
    Dimensions (mm) 1980(L)*1500(W)*1600(H)
    Equipment weight(kg) About 1900KG

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