EDS15 is a fully automated and high-speed die sorter. It can handle any wafer sizes up to 300mm and can reconstruct wafers to different output form factor.
Key features of EDS-15 Die Sorter:
- Handles wafer sizes up to 300mm
- Machine throughput up to 20,000 UPH
- Ability to handle die size of 04×02 mm or larger
- SideWall Inspection capability with Estek proprietary special design lighting
EDS15 is used for wafer-to-wafer sorting application with turret pick and place mechanism. The Die Sorter EDS15 offers ultimate performance with versatility, flexibility and can handle the most challenging application for die sorting.
SPECIFICATION
Facilities
- Voltage: 415V, 3 phase, 10A
- Vacuum: 80kPa @ 500L/min
- Temperature: 20 ~ 30°C
- Humidity: 18 - 70% RH Non-Condensing
- CDA: 6 Bar 200L/M
Vision Capabilities
- Input Vision: Sidewall Vision Right
- Top Vision: Sidewall Vision Top
- Aligner Vision: Sidewall Vision Bottom
- Bottom Vision: Output Vision
- Sidewall Vision Left: Setup Vision
System Capability
- UPH up to 10k
- Number of Pick-Up Head 24
Packages
Input Module
Output Module
Website Link: https://estechs.com/?page_id=474