ESTEK AUTOMATION SDN BHD

EDS15 is a fully automated and high-speed die sorter. It can handle any wafer sizes up to 300mm and can reconstruct wafers to different output form factor.  

Key features of EDS-15 Die Sorter:

• Handles wafer sizes up to 300mm
• Machine throughput up to 20,000 UPH
• Ability to handle die size of 04×02 mm or larger
• SideWall Inspection capability with Estek proprietary special design lighting

EDS15 is used for wafer-to-wafer sorting application with turret pick and place mechanism. The Die Sorter EDS15 offers ultimate performance with versatility, flexibility and can handle the most challenging application for die sorting.

SPECIFICATION

Facilities

• Voltage: 415V, 3 phase, 10A
• Vacuum: 80kPa @ 500L/min
• Temperature: 20 ~ 30°C
• Humidity: 18 - 70% RH Non-Condensing
• CDA: 6 Bar 200L/M

Vision Capabilities

• Input Vision: Sidewall Vision Right
• Top Vision: Sidewall Vision Top
• Aligner Vision: Sidewall Vision Bottom
• Bottom Vision: Output Vision
• Sidewall Vision Left: Setup Vision

System Capability

• UPH up to 10k
• Number of Pick-Up Head 24

Packages

• WLCSP

Input Module

• Up to 12"Wafer

Output Module

• Up to 6"Wafer

Website Link: https://estechs.com/?page_id=474

The EWS100 is a wafer inspection platform that leverages on ESTEK innovative Vision Technology. It delivers high-throughput and precision wafer-level and tile inspection.

Advanced Motion couple with our vision systems provide dramatically improved positioning and alignment capability. User-friendly software improves efficiency and provides compatibility.

Estek provides dedicated inspection solutions to address the special requirements for LED manufacturing process.

SPECIFICATION

Facilities

• Voltage: 220VAC Single Phase
• Frequency: 50/60 Hz
• Power Consumption: 2.4KVA
• Temperature: 20 ~ 30°C
• Humidity: 18 ~70% RH Non-Condensing
• CDA: 6 Bar 200L/M

Camera

• 25M Color Camera
• 100M Color Camera with Pixel Shifting Technology
• 2um Resolution

Lens

• Tele centric Lens

Lightings

• Full Color RGB
• Co-axial
• Back Light
• Wafer System
• Wafer Size: 4", 6", 8" and 12"
• Wafer Handling: Gripper
• Conversion time (Standard): 15 mins

Packages

• Dimension (W x D x H): 1500 x 1200 x 2000mm (For 8" Wafer Only)

Weight (Net)

• 1300kg

Website Link: https://estechs.com/?page_id=476

The ELS3600 is a lens inspection system which incorporated with high-performance camera, an image processor couple with our proprietary vision software to solve complex inspection need for lenses.

SPECIFICATION

Handling

• Input Type: Waffle Tray / Special Tray
• Output Type: Waffle Tray
• No. Pick & Place Head: 2 Heads

Vision

• Camera & Lens: Multiple Angles & Sides Inspection
• Lighting: Bright Field & Dark Field

Machine Layout

• Dimension: L1350 x W1160 x H2100mm

Reject

• Reject Tray: 5 Bin Waffle Tray

Additional Feature

• Secs / Gem
• Class 1000
• Hepa System

Website Link: https://estechs.com/?page_id=1507

Fully automated and high-speed die sorter, it can handle any wafer sizes up to 300mm.  Configurable for Multi carrier: Wafer frame 300mm wafer, JEDEC tray, Waffle/Gel Pack, and Tape and Reel, Grip Ring.

SPECIFICATION

System Capability

• UPH up to 10K (wafer size: 0.2x 0.3mm)
• Number of Pick-Up Head 24

Packages

• WLCSP/ Unit Package

Input Module

• Up to17” Wafer Frame
• Up to 13" Hoop Ring
• Waffle Pack
• Gel Pack
• Tape and Reel (Detaper)
• Jedec Tray

Vision Capabilities

• Input Vision
• Top Vision
• Aligner Vision
• Bottom Vision
• Sidewall Vision Left
• Sidewall Vision Right
• Sidewall Vision Top
• Sidewall Vision Bottom
• Output Vision
• Setup Vision

Facilities

• 415V, 3 Phase, 10A
• 6 Bar CDA at 200L/min
• Vacuum - 80kPa @ 500 L/min
• Humidity 18 ~ 70% RH Non-Condensing
• 20 ~ 30ºC

Website Link: https://estechs.com/?page_id=1519