Evatec AG

Trübbach,  Switzerland
http://www.evatecnet.com
  • Booth: 1601

Welcome to the "Thin Film Powerhouse".

Overview

Evatec delivers complete thin film production solutions for Advanced Packaging, Semiconductor, Optoelectronics and Photonics. We offer a range of batch, cluster and inline platform architectures for deposition of metals, TCOs, and dielectrics according to your production throughput and fab integration needs. Evatec Advanced Process Control (APC) technologies maximise throughput and process yield.

From the sputter deposition of next generation AlScN piezoelectric materials enabling 5G on CLUSTERLINE® to new clustered high throughput metallization solutions on 6 and 8 inch in our Multi BAK (BAK 941) Evaporators, visit our booth to find out how our production tools can help you solve your production challenges in MEMS, Power Devices and Wireless Communication.

Visit the booth to learn about our new generation HEXAGON tool, designed for Wafer Level Packaging applications to give the lowest Rc values and the best cost of ownesrhip in the industry. Within Optoelectronics drive down your costs for deposition of ITO, mirrors and contacts in production of LED, VCSEL and Micro Display using the latest developments on our CLUSTERLINE®  200 BPM that enhance uniformity, drive down particles and enhance throughput. 

The Evatec team look forward to welcoming you to booth 1601.

  Products

  • CLUSTERLINE® 200BPM
    Want to improve process accuracy and repeatability? Want to reduce particles? From Micro LED to Edge Emitting Lasers and RF filters, CLUSTERLINE® 200 BPM gives you gold medal winning performance in thin film deposition.

    ...

    • Watch the video and then speak to our Evatec specialists at booth 1601 to find out how we can support you across a whole range of applications in Semiconductor, Optoelectronics and Photonics
  • HEXAGON
    Process 300 or 200 mm substrates with highest throughputs achieving lowest Rc in the industry. HEXAGON is the production platform that puts you ahead in UBM, RDL and Fanout....

    • HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering high speed degas, etch and metal deposition. Find out more by watching our video or speak to our Evatec experts at booth no. 1601.
  • CLUSTERLINE® FAMILY
    A flexible family of 200mm and 300mm cluster tools...

    • CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all 6 Evatec core markets.

    Whatever your application, our specialists can help you configure an ideal CLUSTERLINE® platform for you. We deliver complete process solutions including highly aligned magnetic films, high performance piezoelectrics like AlScN for broadband RF filters and highly efficient energy harvesting devices, high aspect ratio TSV metallization in Advanced Packaging or precise deposition of TCOs and multilayer dielectrics for the latest micro LED and 3D filter technologies.

    For more information please see our product broschure here or come to our booth E3251 to get the support from our experts!

Categories

207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
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