Established since 2014, Glint Materials is the first pioneering company developing and manufacturing non-slip dry adhesive pads especially for semiconductor industry where requires precise substrate handling.
Our unique technology provides the controllability of directional adhesion force. For example, strong horizontal adhesion force but popping free when the substrate is separated from the pad.
Conventional substrate handling methods are limited to resolve chronic issues such as sliding, misalignment, contamination, and damages in the semiconductor and display industry. SurfCon® is an innovative dry adhesive non-slip pad solution which is inspired by precision polymer engineering and micro patterning technology.
Glint Materials has highly educated and semiconductor industry- oriented human resources who can provide various kind of material solutions depending on customer’s technical requirements.
Glint Materials is growing as a globalized manufacturer who can immediately respond with tailored solutions for the customers in worldwide.