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GTA MATERIAL CO., LTD.

New Taipei City,  Taiwan
http://www.gta.com.tw
  • Booth: 1337

Overview

GTA Material Co., Ltd was established in New Taipei City as of July, 1993. The company’s main purpose was to supply equipments, machinery and materials targeted at the Semiconducting, LED, and SMT industry.
By applying an innovative theory and style in producing the most proficient product, GTA has shown an outstanding performance within a global perspective. Throughout the years, GTA has expanded its offices domestically and internationally consisting of Taoyuan and Tainan in Taiwan as well as Dong-Guan and Soochow in China. With this said, by having a global vision of the future, GTA is and will always be in the process of targeting challenges and competitions and is determinate to set in motion within thriving past expected goals.

  Products

  • Dewax
    Surfactant additive to improve lubricity
    Good cooling effect during the dicing process
    Prolong the service life of the cutting knife
    Effectively improve the corrosion of wafers...

    • "Developed and uniquely innovated by GTA, GTA's Dewax is water soluble chemical substances intended and suitable for the industrial cleaning rocess. This substance is of a clear color that contains benzene and halogen hydrocarbon fraction of petroleum solvent that has excellent solubility for waxes, oil, and other compounds.
    It can remove immediate residues, oily compounds as well as other dirty substances off of wafers to produce excellent shining finish effects."
  • Clean Dice
    Surfactant additive to improve lubricity
    Good cooling effect during the dicing process
    Prolong the service life of the cutting knife
    Effectively improve the corrosion of wafers...

    • CleanDice is designed specifically for the semiconductor industry. It is a surfactant assistive mixed along with DI water to improve lubricity and cooling as well as removing  particles and corrosion.
  • Flux Cleaner
    Low Odor
    Halogen-free
    Excellent material compatibility
    Mild saponification to rapidly dissolve harden flux residues
    Low surface tension to wetting, penetration and cleaning of flux residue
    Made without, nor contains any heavy metal chelators like 'E.D.T.A.'...

    • Flux Cleaner is a liquid cleaner added to water to make a non-foaming solution for removing flux residue. It is alkaline,  water based cleaner for dissolving fluxes and cleaning other board or assembly contaminants.
  • Laser Sawing Solution
    Reduce the heating and burning effects during the laser cutting process
    Decrease the sum up of particles stickled onto wafers
    Provide a coating protection for wafers
    Provide a debris free quality during the cutting process
    Fully water-soluble solution...

    • Laser Sawing Solution is designed specifically for the laser cutting process. Perfectly suitable for laser cutting that improves the lubricity while improving of coolant created by the cutting process.
  • Wafer Dicing Tape
    Stable adhesion force and reduced adhesion after 365nm UV exposure.
    With high modulus design, the adhesive strongly wafer in dicing and avoid chipping or burrs on cut edges.
    No adhesive residue would stay on substrate in the tape tear-off process....

    • The acrylic PO tape and PVC tape is suitable for application in wafer dicing process. The high modulus adhesive strongly support wafer in the dicing process and avoid chipping or burrs on cut edges. The adhesive layer shows stable adhesion at ambient condition, sensitive to UV-light, easily removable after exposure of 365nm LED without leaving adhesive residue.
  • Wafer Back-Grinding Tape
    Stable adhesion force and reduced adhesion after 365nm UV exposure.
    Excellent adhesion, no adhesive residue on substrate in the tape tear-off process.
    The adhesive is composed of modulus gradient layers and the buffer layer is high elastic modulus....

    • The acrylic PET tape and PO tape is suitable for application in wafer back-grinding manufacture. The adhesive is composed of gradient stacking layers. The layer in contact with Si-wafer shows high adhesion, sensitive to UV-light and easily removable after exposure of 365nm LED. The buffer layer is high elastic modulus and high creep, which would eliminate the warpage of Si-wafer, encapsulate the bump of Si-wafer and preventing water infiltration.

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Thermal Interface Materials; Heat Sinks
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Surface protection material; coatings
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