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Hefei ImagEx Electronics Technology Co., Ltd.

  • Booth: 314

Overview

Hefei Imagex Electronic Technology Co., Ltd is a corporation established in  April 2009. Imagex delivers high quality vision inspection, services and provides the best solution in semiconductor, electronics, solar energy and other fields in application, research and development.  

Imagex has the best 2D & 3D vision inspection technology and AI defect inspection technology. Our product includes:chip package surface inspection module, dimensional measurement module, shape-to-pair module, 3D measurement module and AOI surface defect inspection system.

Our main customers are semiconductor sealing plant, Fab and IC package design industry which base not only China but also South East Asia counties. Currently our IC packaging vision inspection system has become the first choice of domestic and international enterprise.

Imagex has its own intellectual property right, professional research and development team and high efficiency service support team to deliver excellent service to end user.


  Products

  • Intape 3D module
    This module not only can provide Carrier tape inspection with existing 2D inspection feature, it also provided 3D height of product lead inspection to judge product lead standoff pass or fail....

  • 1.Compared with the conventional stereo vision computing system that uses two sets of optical equipment, this module only uses one set of optical equipment, which can also achieve the calculation effect of the conventional stereo vision system;
    2.Compact size design, suitable for all main turret installation space;
    3.Advanced efficient 3D data processing algorithm, fast operation speed, does not affect the efficiency of the machine;
    4.Carrier Intape 3D inspection, resolved and provide solution to existing 2D Carrier tape detection inaccuracy and misjudgment issue;
    5.Intape 3D+PSI, completely replace manual inspection.
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