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Henkel Singapore Pte Ltd

  • Booth: 3521

Think Innovation, Think Henkel

Overview

Building on a strong legacy of more than 145 years, Henkel is leading the way to reimagine and improve life every day. Today and for generations to come. Through our innovative and sustainable brands and technologies, across our teams around the world, Henkel holds leading positions in both industrial and consumer businesses. Our portfolio includes well-known hair care products, laundry detergents, fabric softeners as well as adhesives, sealants, and functional coatings.

For many years, we have been dedicated material suppliers to the Southeast Asian electronics and semiconductor community, empowering the innovations of tomorrow in automotive, mobile, and consumer devices.

Whether you're familiar with Henkel or not, we invite you to visit our stand #3521, enjoy some coffee on us, engage with our team, and discover the latest from Henkel, including

  • Brand new ultra-high thermal (>200 W/m-K) sintering solutions
  • Advanced packaging underfills for today’s most complex 2.5-D packages
  • A full range of die attach pastes and films for high-reliability automotive devices
  • Market-leading structural adhesives for high-performance consumer devices
  • Bio-based / PFAS free material innovation
  • Plus, learn about our global and local R&D resources, application engineering expertise, sustainability leadership, and more

Don't miss out the following sessions where we will be sharing insights:

1. Innovation in Motion: Automotive-Grade Semiconductor Packaging Materials

  • Speaker:  Mr. Rejoy Surendran | Market Strategy Manager
  • Date: May 28, 11:40 – 11:55 am
  • Venue: Meet-the-Expert at TechStage (Level 2, Hall 6)

2. Innovative Material Solutions in New Era of Heterogeneous Integration.

  • Speaker: Dr Rose Guino | Manager Application Engineering
  • Date: May 29, 15:30 – 15:55 pm
  • Venue: Chiplet Technology and Heterogeneous Integration Summit (Level 1A, Novel 2)


  Press Releases

  • Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices. 

    HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (>40 mm x 40 mm) and substantial package body sizes (>100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.

    Henkel has developed a brand-new capillary underfill formulation that meets the dimensional demands of highly integrated package designs. Loctite Eccobond UF 9000AE completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material’s low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Loctite Eccobond UF 9000AE also has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.

    Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran (Ram) Trichur, acknowledges that while thorough, rugged bump protection against thermal cycling strain and mechanical damage is the highest underfill priority, processability is critical to achieving throughput and yield objectives.

    “Loctite Eccobond UF 9000AE delivers no-voiding bump encapsulation of flip-chip BGA, Cu pillar, and other high-density interconnects, which is fundamental to preserving the value and function of these high-performance devices,” Trichur says. “Notably, however, this material does so faster than our prior generation underfills, allowing for greater flow efficiency, which is an important feature for complete interconnect coverage and encapsulation across large surface areas.”  

    In internal testing versus previous generation capillary underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow* on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. Its edge-to-edge capillary flow efficiency ensures interconnect encapsulation prior to any material gelation, eliminating the risk of exposed bumps. So far, Loctite Eccobond UF 9000AE’s performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm.

    “The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore’s Law,” Trichur says, citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages. “Henkel has been at the forefront of enabling these devices with novel semiconductor materials, and our new underfill further demonstrates our contributions to this dynamic market space.”

    Learn more about Henkel’s advanced semiconductor packaging materials at https://www.henkel-adhesives.com/sg/en/industries/electronics.html

    * Die size dependent. 

  • As a global leader in adhesives, sealants and functional coatings Henkel Adhesive Technologies is constantly driving sustainability based on its Sustainability Ambition 2030. The business unit aims to lead by example as well as through innovative technologies – and by providing full transparency on the sustainability impacts of individual products in the cradle-to-gate and use phase. This so-called end-to-end transparency which is based on reliable data and a consistent measurement methodology according to leading international standards is essential to improve Henkel´s footprint as well as the footprint of its customers. 

    To provide its more than 100.000 customers in over 800 industry segments with a comprehensive sustainability profile and performance of its products, Adhesive Technologies has developed and implemented a digital solution in collaboration with Henkel´s digital department and Capgemini. This novel measurement platform – the ‘Henkel Environmental Assessment Reporting Tool’ (HEART) –enables the automatic calculation of the product carbon footprint of about 58,000 products. The tool maps the cradle-to-gate emissions including the emissions of raw materials, production, packaging, and logistics. This calculation methodology has been thoroughly verified and certified by TÜV Rheinland (ID-Nr. 0000086028: Henkel AG & Co. KGaA – Certipedia).

    “Our certified calculation methodology combines high-quality data with a novel digital measurement platform and enables us to quickly provide comprehensive PCF reports across a significant and continuously increasing percentage of our products,” explained Ulla Hüppe, Vice President Sustainability at Henkel Adhesive Technologies. “Our customers now receive full transparency on the individual cradle-to-gate sustainability impact of the vast majority of our portfolio which is essential for them to better understand the impact of their products and to further reduce their emissions. The novel HEART tool not only marks another important milestone towards our promise to deliver 100 percent end-to-end transparency on all our products by 2030. It also helps us to analyze and steer our portfolio based on data-driven results and to further expand our low emission products portfolio in the future.”

    Henkel is participating in different industrial sustainability initiatives to pioneer and collaborate in transparency for end-to-end product life cycle analysis and PCF reporting. The company is a member of ‘Together for Sustainability’, an initiative that supports and coordinates the measurement of the sustainability performance of chemical companies and their suppliers. Henkel also has joined Catena-X, a pan-European network that aims to standardize the methodology for calculating footprints and the associated data exchange for all participants in the automotive value chain. 

  • Henkel announced today that its new phase change thermal interface material (TIM), Bergquist Hi Flow THF 5000UT, has been named the Global Technology Awards’ TIM category winner. Bergquist Hi Flow THF 5000UT is a groundbreaking phase change material that provides excellent thermal performance without the requirement for extreme mechanical pressure. Even under low pressure, the material achieves thorough wet out. It forms an ultra-thin bond line at the interface, enabling low thermal resistance and excellent heat dissipation for some of today’s most challenging high-performance applications.

    The cutting-edge Henkel thermal interface solution was named the award winner during a November 14 ceremony at the productronica trade show event in Munich, Germany. Recognizing the best innovations in the printed circuit assembly and semiconductor packaging industries, the Global Technology Awards are presented annually by Global SMT & Packaging magazine.

    Trevor Galbraith, Global SMT & Packaging Publisher and Editor, congratulated the Henkel team, highlighting the company’s innovation track record. “Once again, Henkel has demonstrated its formulation expertise with yet another Global Technology Award win,” he commented. “This is the latest in multiple Global Technology Awards for Henkel, many of them in the TIM category. Well done!”

    Ideal for high-performance compute and industrial applications where thin, multi-die designs are the norm and space is limited, Bergquist Hi Flow THF 5000UT helps protect devices from stress-induced damage and delivers exceptional thermal performance. The silicone-free material has demonstrated low thermal impedance for different bond line thicknesses while subjected to ultra-low and low pressures (0.04° C-cm2/W at 35psi, 0.06° C-cm2/W at <10 psi). Evaluated at up to 150° C, Bergquist Hi Flow THF 5000UT has achieved thermal conductivity as high as 8.5 W/m-K and has exhibited excellent performance over a wide power range of up to 800W. These attributes provide much-needed thermal control for demanding high-reliability devices like ultra-high-power networking processors.

    “In addition to its stand-out thermal capability under very low pressure,” said Wayne Eng, Henkel Data & Telecom Global Head of Market Strategy, “Bergquist Hi Flow THF 5000UT offers simple application for heat sink suppliers and easy final assembly. Its mess-free film medium can be applied to heat sinks before shipment, and the material does not require pre-burn prior to use, saving valuable production time and cost. We are honored to have been recognized and thank Global SMT & Packaging magazine for offering this forum to showcase innovations like Bergquist Hi Flow THF 5000UT.”

    More information about Bergquist Hi Flow THF 5000UT is available here.

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