Light without limits.
Overview
Established in 2019 as a spin-off from CERN, inPhocal is revolutionizing laser beam technology. Our proprietary enhanced focus technology, combined with an experienced team allows us to generate a laser beam with a spot size as narrow as 0,5um. This allows for wafer dicing at high speed, with minimal burr and virtually no debris fallout.
Next to traditional semiconductor lines, this enables easy heterogeneous integration, without extra processing steps.
Our groundbreaking technology can be utilized for diverse purposes such as marking, cutting, welding, surpassing prevailing inkjet and laser marking methods. In marking we have proven the technology to be superior to conventional methods, reducing the required machinepark.