Key features:
Compatible with 4, 6, 8 inch wafer, flexible and convenient
Double port circulation feeding and unloading, reduce operator waiting time
Dual optical path line array + area array imaging system, fast scanning
Support bright field + dark field lighting mode
Multiple focus modes are fitted based on hardware, software
Support multi-ROI and multi-layer partition inspection
Support D2D, D2G, and D2DB inspection mechanisms
Support AI defect identification and defect classification