Kedtech Enterprise

Jalan Gurdwara,,  Pulau Pinang 
Malaysia
http://www.kedtech.biz
  • Booth: 933

KED Tech: Advancing Semiconductor Cleaning Solutions!

Overview

KED Tech, established in 2007, emerged as a significant player in the manufacturing sector, specifically focusing on wet cleaning process equipment tailored for the rapidly expanding semiconductor and electronics industry.

In semiconductor manufacturing, the cleanliness of components and surfaces is paramount to achieve optimal yields and device performance. Any contaminants, residues, or particles present on semiconductor wafers or within the processing equipment can lead to defects, reduced device reliability, and yield losses. Our products cater to both front-end and back-end processes, effectively remove contaminants, residues, and impurities from various surfaces, including silicon wafers, semiconductor substrates, and equipment components.

By fostering partnerships with semiconductor manufacturers, equipment suppliers, and research institutions, KED Tech aims to remain at the forefront of providing cutting-edge cleaning solutions that contribute to the advancement and success of its customers in the global semiconductor market.

  Products

  • Co-Solvent Vapor Phase Cleaning Machine
    VC series: A co-solvent vapor phase cleaning machine immerses parts in ultrasonic solvent to remove particulates, then exposes them to vapor to dissolve remaining contaminants....

    • VC series is a vapor phase cleaning machine. It is a type of cleaning machine that uses ultrasonic and vapor phase solvent to clean parts and components. The parts to be cleaned are immersed into the ultrasonic solvent to remove the particulates off into the solvent, then placed in a chamber above the tank, where the vapor condenses on the surfaces and dissolves any contaminants.
  • Spray-In-Air Inline Cleaning Machine
    Our fully automatic inline cleaner is perfect for semiconductor packaging residue removal. It efficiently conducts chemical cleaning, DI water rinsing, and drying in bulk. With outstanding efficacy, it eliminates flux, organic, and inorganic contaminants....

    • Our range of fully automatic inline cleaning machine is suitable for semiconductor packaging residual cleaning. It is able to conduct all the processes of chemical cleaning, DI water rinsing and drying in large quantities. It has excellent cleaning effect, able to remove flux, organic and inorganic contaminants effectively.
  • Semi / Auto FOUP Cleaning Machine
    We have range of semi-auto and fully automatic FOUP cleaning machine that suitable to clean wafer carriers such as FOUP, FOSB & cassette....

    • These machines remove movable impurities, dust, and other harmful contaminants inside the FOUPs to prevent secondary contamination of the products inside the FOUPs, better meeting the ever-increasing demands of customers for high quality and high reliability.
  • Single Wafer Cleaning Machine
    Fully automatic wafer cleaning machine designed primarily for removing cutting residues and contaminants from the surface of wafers....

    • WPC640 is a fully automatic wafer cleaning machine designed primarily for removing cutting residues and contaminants from the surface of wafers. It utilizes a dual-fluid cleaning system, which can be configured in sections. Additionally, it employs CDA (Clean Dry Air) for water cut purposes and high-speed centrifugal drying to ensure efficient cleaning and drying of the wafers. This configuration
    and functionality make the WPC640 suitable for high-precision cleaning requirements in semiconductor manufacturing and other related industries.
  • Advanced Inline Ultrasonic Cleaning Machine
    This machine is specially designed to remove solder paste and flux that are utilized in the substrate and leadframe clip bonding (DFN, SOP/T) products....

    • Our advanced ultrasonic cleaning machine is specially designed to remove solder paste and flux that are utilized in the leadframe clip bonding (DFN, SOP/T) products. The cleaning procedure is aimed at
    ensuring that there are no volatile residues, hidden cracks, or any other quality issues present on the surfaces of both the product's frame and chip. Moreover, the cleaning process will not have any adverse effects on the wire bonding of the product or its adhesion with the encapsulation material.
  • CMOS Cleaning Machine
    We have range of auto and semi-auto CMOS cleaning machines that cater to remove impurities from CMOS sensor, VCM and optical lens product....

    • Our CPC CMOS cleaning series consists of high power and concentrated CMOS cleaning machine. Equipped with two-fluid high-pressure spray, static elimination, high-speed centrifugation technology, they can wash out very little micro dust and make the parts dry faster, ensuring no damage on products and low DI water consumption. 

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate; Fab Processing
    • 700 Manufacturing Services
  • Parts Cleaning; Micro Contamination
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