Keysight Technologies' s8050 Electrical Structural Test (EST) Solution utilizes capacitive technology to enhance defect detection in IC wire bonds, identifying issues like near-shorts, stray wires, and wire sags. It tackles Electrical Overstress (EOS) effects, helping to improve chip integrity, reduce product returns, and ensure the reliability of electronic products. The s8050 supports 20 parallel test sites, enabling a high throughput with a Units Per Hour (UPH) rate of about 72,000, optimizing production testing efficiency. Suitable for various package types such as QFP, QFN, and BGA, it integrates well with strip and singulated handlers, making it a versatile tool in electronic package testing. The system comes with an analytics software that provides a deeper understanding of data, unlocking hidden patterns and opportunities for optimization and yield improvement. Its predictive maintenance capabilities forecast potential failures, allowing for preemptive actions that reduce downtime and extend the equipment's lifespan.