Kyzen Sdn Bhd

MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of Cu Pillar flip chips, 2.5D/3D ICs, SiP and AiP. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MICRONOX MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.

• Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
• SAC, Aluminum and Copper Safe
• Lowers Surface Tension
• Superior Rinsing Ability

MICRONOX MX2120 is an aqueous, single-phase cleaner designed to remove tough flux residue from all types of power modules that utilize nickel and most copper DBC as substrates. MX2120-LF has a well-balanced formula that provides outstanding cleaning performance and metal compatibility. MICRONOX MX2120-LF leaves great metal surface conditions for the post wire bond and potting processes. It is designed to be effective in in-line SIA cleaning systems and is easily monitored and controlled.

• Designed for IGBT Module in In-line SIA
• Excellent Compatibility on Nickel, Aluminum and Most Copper
• Effective on All Types of Flux Residues
• Long Bath Life at Low Concentration