A high-tech company engaged in R&D, production and sales of semiconductor packaging equipment. The core team are from well-known company. At present, we more than 60 patents. Our products include IC level 8-inch and 12-inch die bonder, FC die bonder, Soft solder die bonder, which has been verified by major customers. The products under development include high-precision flip chip die bonder and advanced high-precision stack die bonder.