ARP series (Ar plasma) well used for wafer spin coating, to improve coating uniformity. And for RDL patterning process, it could help to remove photoresist residues (descum process) and induce surface hydrophilicity for the Cu plating process. And before the die attach process, it’s applied in the pre-molding step to prepare and activate the surface to improve the mold adhesion and the flow of the mold material around the attached dies.