Loading...

Nextool Technology Co.,Ltd

Tongling,  Anhui 
China
http://www.nextooling.com
  • Booth: 722

NEXTOOL is an integrated supplier of semiconductor equipment

Overview

NEXTOOL company is an integrated supplier of semiconductor packaging equipment. 

The main products are NTAMS180/NTAMS120 Auto packaging system;  NT-S450A,NT-S250A,NT-S250B series molding press; CSP molding system; provide traditional molding press servo upgrade; softwear upgrade; a variety of Trim&Form&Singulation system and spare parts.

>NEXTOOL listed on Shanghai Sci-Tech innovation board (STAR stock Market) in Nov. 2022, stock code: 688419.

>Awarded the title of "Manufacturing championship of single event "title by Ministry of Industry and Information Technology of China.

>Management system qualified through ISO9001:2008 certification standards.

>With qualification of ”China National High-Tech Enterprise “ and  “Anhui Provincial Technology Center”.

>More than 100 Technical  patents being achieved during 30  years’ experience in research & development .

>CAD/CAM/CAE/ERP/CRM Ⅱ , the world latest computer network systems are introduced in design , manufacturing &  management process.

>The factory covers 60000 square meters, more than 500 employees, key equipment are imported from Switzerland , Germany , Japan and etc.

  Press Releases

  • NEXTOOL was established in 2005 and is an integrated supplier of semiconductor packaging equipment. In 2022, it listed on the Science and Technology Innovation Board (STAR Market) with the stock code 688419. The company was awarded the "Manufacturing Industry Single Champion Demonstration Enterprise" by the Ministry of Industry and Information Technology and holds 31 invention patents. Its leading products include the 120T and 180T fully automatic packaging systems, fully automatic wire bonding and molding systems, AUTO MGP system, plastic molding and wire cutting molds. Board-level and wafer-level packaging technologies are also about to be launched. 

  Products

  • Auto Molding System
    For post-process packaging of IC, semiconductor device and LED substrates. The applicable product packaging forms are: SOP, SOT, SOD, SMA, SMB, DFN, QFN, QFP, BGA, SCP, PLCC, MCM, IGBT, IPM, TO, LED substrates and etc.
    ...

    • NTAMS180/120 structure：
    1. Magazine loading unit
    2. L/F alignment unit
    3. L/F haul-off unit
    4. L/F preheat unit
    5. EMC feeding unit
    6. Loading unit
    7. Unloading unit
    8. Collecting unit( de-gate, boxing)

    Optional function：
    1. Mobile preheating platform
    2. EMC weighting function
    3. Visual inspection function
    4. Dusting function of concave die
    5. Anti-deviation detection function of concave die
    6. QR code scanning
    7. SECS network communication

  • Auto Trim&Form&Singulation system
    Adapt to a wide variety of products, using modular design, easy for extending...

    • Mainly used for punching and shaping after the packaging of TO、SOT、SOD、DFN、SOP、TSOP、QFP、LQFP and other products.

    Feature:
    Automatically completes actions such as product feeding, tendon cutting, shaping, separation, or tray loading.

    Structural Features:
    Feeding unit, punching unit, unloading unit, separation unit, and tray storage unit can be flexibly combined according to different process requirements of the product.

  • Transfer Molding press
    For post process packing of IC,semiconductor devices and LED substrates.The main applicable product packing forms are small spacing products like TO,DIP,SOP, SOT,SOD,SMA,SMB,QFP, IPM,LED and etc., matching with MGP mold and traditional single mold....

    • Multi-option function configuration,suitable for custom-ize product needs from different users:

    ● Slow injection function and ultra-slow clamping functionmodule.

    ● QR code scanning.

    ● Mould protection system.

    ● T＋TA function.

    ● Thimble Oil System.

    ● Mould vacuum system.

  • MGP Mold
    Mainly used for post-process packaging of integrated circuits and semiconductor devices
    ...

    • Structural features
    Multi-barrel, multi-injection head packaging, the mold box adopts fast-changing structure, easy maintenance.
     
    Applicable packaging products
    All kinds of IC products within 100 leads: TO, DIP, SOP, SOT, SOD, SMA, SMB, OFP, IPM, LED and etc., tantalum capacitor, bridge stack and other products.
  • Auto MGP system
    The AUTO-MGP packaging system is a new automated packaging system that utilizes a traditional 450T servo plastic sealing machine and MGP molds to achieve full automation in production.
    ...

    • Main Functions:
    1. Automatic feeding of lead frames with L/F direction detection capability.
    2. Automatic supply of material reels with weighing function.
    3. Automatic mold cleaning and vacuuming function.
    4. Automatic runner punching and material collection function.
    5. Support for SECS protocol for semiconductor communication.
    6. Data query and backup function.
    7. External CCD inspection function (optional).
    8. Max suitable size: 285x90mm
    9. Max clamp pressure: 450T , Injection pressure(KN)：7 Ton  

Categories

200 Equipment, Assembly
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Molding; Encapsulation; Decapsulation Equipment
    • Back to the Search
    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined
    For Technical Support with this webpage, please contact support.