Onto Innovation Southeast Asia Pte. Limited

Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. This new technology is the foundation of Onto Innovation’s products designed to offer fast throughput, increased brightfield and darkfield sensitivity and solves site challenges related to large package inspection.

The Dragonfly G3 system offers Clearfind® Technology for non-visual residue detection. For specialty markets, such as CMOS image sensors (CIS), the Dragonfly System uses a combination of oblique angle illumination with sophisticated image processing and a machine-learning algorithm to detect low contrast defects in the active pixel sensor area.The Dragonfly G3 system is tightly integrated with control and analytical software for real-time analysis and review, IR defect inspection and review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users now have the tools to visualize data, correlate process variations and improve yields through exploratory data analysis down to the bump level.

The Firefly G3 platform offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique to detect residue defects on metal and metal defects on organic layers. The combination of high sensitivity inspection, 2D/3D metrology and on tool color image capture capability in a single platform reduces capital investment requirements and provides a reliable pathway for panel-based process applications that require high I/O counts and multiple-chip integration.

Integration with Onto Innovation’s Discover® Defect and TrueADC® software quickly turns defect data into actionable process control, improves defect classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.

Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.

The Aspect system is powered by a powerful software analysis engine, Ai Diffract™ Technology, that provides up to 90% faster time to solution which extends the industry leading NanoDiffract® software by leveraging extensive machine learning capabilities along with high fidelity modeling. The result is a simultaneous improvement in metrology performance along with a significant time to solution reduction.

TrueADC’s one agnostic platform accepts results from all defect scan and optical review systems, including SEM. Featuring smart factory-style automation extendable across an entire supply chain, TrueADC is the only automated defect classification solution you need.

With deployable classifiers in as little as eight hours and high-speed classification rates over 180 defects per minute, TrueADC is the one Automated Defect Classification system for your entire Industry 4.0 enterprise. TrueADC’s one agnostic platform accepts results from all defect scan and optical review systems, including SEM. Featuring smart factory-style automation extendable across an entire supply chain, TrueADC is the only automated defect classification solution you need.

Choose the best implementation. TrueADC can perform classic SPC enhanced defect Paretos or deliver a definitive quality assessment of each die based on every defect, killer or non-killer. What are your goals? Defect Paretos allows engineers to quickly drive toward root causes based on specifically identified types of defects. As a definitive outgoing quality assessment (OQA) tool, TrueADC classifies a die based on its specific defects - effectively reducing the opportunity for escapes and overkill.

Trust in automation. TrueADC’s multi-engine AI and non-AI modes leads to a matter-of-fact classification; it’s like two operators reviewing the same defect then reaching a consensus based on their overlapping perspective. Re-review of a TrueADC classified defect is a thing of the past.  

Preserve your AI investment. Integrate TrueADC with your proprietary classification engines to leverage internal expertise. Adopt and apply different deep learning model architectures. Incorporate 3rd-party models. However you imagine the next level of your DL implementation, consider us your partner. 

Maximize value with Onto Innovation. When TrueADC is integrated with Onto AOI tools and our Discover Defect and Discover Review platforms, customers benefit from a proprietary hybrid decision-making process across all wafers and surfaces – delivering the best results in the shortest time possible.