Oxford Instruments plc

Atomfab is the fastest remote plasma production ALD system on the market.

• Competitive CoO
• Quick, easy maintenance
• Excellent film uniformity
• High material quality
• Low substrate damage
• Faster cycle times, high throughput
• Clusterable and automated wafer handling

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The Jupiter XR Atomic Force Microscope is the first and only large-sample AFM to offer both high-speed imaging and extended range in a single scanner. Jupiter provides complete 200 mm sample access and delivers higher resolution, faster results, a simpler user experience, and the versatility to excel in both academic research and industrial R&D laboratories.

• Higher resolution than any other large-sample AFM

• Extended range 100 μm scanner is 5-20× faster than most other AFMs

• From setup to results, every step is simpler and faster

• Modular design adapts to your needs for maximum flexibility

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The alpha300 Semiconductor Edition is a high-end confocal Raman microscope specifically configured for the chemical imaging of semiconducting materials. It helps researchers accelerate the characterization of crystal quality, strain and doping in their semiconductor samples and wafers.

The microscope’s extended-range scanning stage enables the inspection of up to 12 inch (300 mm) wafers and the acquisition of large-area Raman images. It is equipped with active vibration damping and active focus stabilization to compensate for topographic variation during measurements over large areas or long acquisition times. All microscope components are fully automated, permitting remote-control and the implementation of standard measurement procedures.

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We have introduced a unique patented approach to achieve low damage and high-quality SiC substrate polishing on our 200 mm production platform. Plasma Polish has been proven to produce a damage-free surface and subsurface ideally suited for high yielding 150 mm epitaxial growth.

The SiC substrate surface quality is the starting point affecting the quality of epi, device performance, reliability and lifetime. Achieving an optimal surface is difficult due to the hardness of SiC and the methods used to slice and thin the wafers from the starting boule. Properly conditioning the surface is vital to enable yield and performance down the manufacturing line.

Plasma Polish Dry Etching is an established processing technique within front end processing for semiconductor high volume manufacturing. Oxford Instruments has developed and patented processes and equipment adaptions, providing a comprehensive silicon carbide polishing solution and delivering the surface material quality required for SiC high volume production. 

Unique Benefits

Plasma Polish Dry Etching technique enables you to:

• Achieve uniform epi-ready substrate surface and reduce substrate stress with minimal bow.
• Achieve improved process stability and control through replacement of chemical mechanical processing
• Increase of Epi yield through pre-process substrate selection with respect to benchmark process
• Reduce reliance of toxic materials

Ultim Max EDS detectors use high-end technology to deliver unparalleled speed and sensitivity without compromising on accuracy or quality. This range of detectors combines the largest sensor sizes (up to 170 mm2) with Extreme electronics to deliver remarkable performance.

Only Ultim Max has guaranteed performance at low (CKa and FKa) and high energy (MnKa) at the same highly productive count rate of 130,000 cps for all sensor sizes. Performance is tested on a SEM before shipping and again at installation to ensure every Ultim Max delivers excellent results even under the most demanding analytical conditions (high count rates, low kV, insitu testing).

All Ultim Max detectors can be easily and rapidly inserted when needed and retracted when not in use thanks to an integrated motorised slide.

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What is BEX?

BEX is a pioneering analytical technique for SEM. BEX combines Backscattered Electron and X-ray (BEX) imaging in a single technique, simultaneously. In an industry breakthrough, the best of both techniques are integrated to accelerate your time to discovery.

What can I do with BEX that I couldn’t before?​

Until now, analysis in an SEM has been a static, step-by-step process that relied on experience-based instinct to obtain good results in a timely manner. A secondary electron signal obtains topographical information about a sample. Backscattered electron signal provides indicative compositional information. These data combine to give the typical black and white electron microscope image. To obtain firm compositional information, EDS analysis is then applied. If nothing of interest is found in the area of sample under scrutiny, you have to start over.​

BEX combines the topographic, crystallographic, atomic number and elemental information in an immediate visual output while you navigate around your sample. So you no longer need to trust luck or judgement to find areas of interest in your sample. Instead, BEX allows you to immediately review the results, and either focus in on points of interest or move on. ​

More information about the BEX technique a more in-depth article can be found here.​