Park Systems Pte Ltd

Effortlessly, get the sharpest, clearest, highest resolution images and measurements one sample after another on various applications. Boost your progress and scientific discoveries through unprecedented speed and accuracy – as the Park FX40 autonomously images and acquires data powered by its artificial intelligence, robotics and machine learning capability. The Additional axis cameras automatically align with laser beams and photodetectors. The early warning systems and fail-safes at every step of the way allow you to focus on your research and not the tool.

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As an FA engineer, you’re expected to deliver results. There’s no room for error in the data provided by your instruments. Park NX20, with its reputation as the world’s most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.

More powerful failure analysis solutions

Park NX20 is equipped with unique features that make it easier to uncover the reasons behind device failure and develop more creative solutions. Its unparalleled precision provides high resolution data that lets you focus on your work, while its True Non-Contact™ mode scan keeps tips sharper and longer, so you won’t have to waste as much time and money replacing them.

Easy to use, even for entry level engineers

Park NX20 has one of the most user friendly designs and automated interfaces in the industry, so you won’t have to spend as much time and energy using the tool and supervising junior engineers with the system. This lets you focus your experience on solving bigger problems and providing insightful and timely failure analysis to your customers.

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Park NX-Wafer is the industry’s leading automated AFM metrology system for semiconductor and related fabrications. It provides wafer fab inspection and analysis, automatic defect review for bare wafers and substrates, and CMP profile measurements. Park NX-Wafer has the highest nanoscale surface resolution with sub-angstrom height accuracy, scan after scan with negligible tip to tip variation and preserved tip sharpness unmatched by others.

Park NX-Wafer with its automated system features including auto tip exchanger, live monitoring, target positioning without reference marks and auto analysis makes the best semiconductor AFM tool in the industry.

• Low noise atomic force profiler for more accurate CMP profile measurements
• Sub-Angstrom surface roughness measurements with extreme accuracy and negligible tip-to-tip variation
• Fully automated AFM solution for defect imaging and analysis
• A fully automated system with auto tip exchange, robot wafer handler
• Capable of scanning 300 mm wafers

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Park NX-Hybrid WLI is the first-ever AFM with built-in WLI profilometry for semiconductor and related manufacturing quality assurance, process control for semiconductor front-end, back-end up to advanced packaging, and R&D metrology. It is for those that require high throughput measurements over a large area that can zoom down to nanometer-scale regions with sub-nano resolution and ultra-high accuracy.

The two best complementary technologies for semiconductor metrology:

• WLI: White light interferometry is an optical technique that can image a very wide area, very fast, producing high throughput measurements.
• AFM: Atomic force microscopy is a scanning probe technique that delivers the highest nanoscale resolution measurements even for transparent materials.

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Park NX-IR R300 is a nanoscale infrared spectroscopy system for up to 300 mm semiconductor wafers. It provides chemical property information as well as mechanical and topographical data for semiconductor research, failure analysis and defect characterization at an unprecedent high nano-resolution.

Park NX-IR R300 integrates the most advanced nanoscale IR spectroscopy with atomic force microscopy. It combines the photo-induced force microscopy (PiFM) module from Molecular Vista onto the industry leading Park NX20 300 mm AFM platform.

Park NX-IR R300 is both a spectroscopy and a microscopy system. The spectroscopy part of Park NX-IR R300 provides chemical identification under 10 nm spatial resolution. It uses a non-contact technique offering damage-free spectroscopy scanning and the best in industry spatial resolution. The microscopy part of Park NX-IR R300 provides 3D topography with sub-angstrom height accuracy and material imaging in nanometer lateral resolution.

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Park NX-Mask is the new generation photomask repair system that addresses the latest challenges of shrinking device geometries and increasing photomask complexities. Park NX-Mask is an innovative tool for the repair of high-end EUV Mask incorporating advanced atomic force microscopy technology. It provides all in one solution from auto defect review to repair of defects to verification of the repair, accelerating the throughput at unprecedented repair efficacy.

• No risk of damage and seamless repair of any type of defects
• Compatible with a dual pod for handling EUV masks
• All-in-one solution for locating defects and post-repair verification

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