Precitec 3D Metrology

Not anymore.

The Flying Spot Scanner (FSS) 310 has a flexible, fast-moving measurement point within the field of view, enabling ROI inspections in ultra-short cycle times – without compromising accuracy:

•High-speed ROI inspection: With a huge scan area of 310 mm, the FSS 310 can check a 12-inch wafer for TTV, bow, warp and voids in standards applications in less than 10 seconds.

•Impressive throughout: Over 300 wafers an hour, including handling time.

Precitec Optronik offers a stand-alone solution that enables non-contact thickness measurement of non-transparent components in both inline and offline production processes. Utilizing the geometry of the structure, the thickness of an object is calculated internally in the CHRocodile 2 DPS using the distance data to the two surfaces and provided directly to the user as a measurement signal.

This 3D metrology workhorse - the line sensor CLS 2Pro is well suited for up to 90 percent of the most common applications in semiconductor production. The key benefits are its fastest-in-class measurement performance, world-leading NA-to-line-length ratio, great flexibility, maximum compatibility, and improved endurance.

Enovasense has developed an innovative laser technology to measure the thickness of all kinds of coatings (e.g. metal, ceramic, paint, polymers, glue, etc.). The Enovasense sensors accurately measure the thickness of opaque layers or coatings as well as nanometer-thin coatings. It enables fast, non-contact, non-destructive measurement of any coating – without damaging the material measured.