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Qdos

Bayan Lepas,  Penang 
Malaysia
http://www.qdos.com.my/
  • Booth: 1801

Welcome to QDOS and visit us at Booth#1801

Overview

Establised in 1994, Qdos is a pioneer manufacturer of Flexible Printed Circuits (FPC) & Molded Interconnect Substrates (MIS) in Malaysia, owned by Suiwah Corp, a Bursa-Malaysia-Listed conglomerate. Equipped with highly automated state-of-the-art facilities, Qdos provides a comprehensive FPC solution, covering circuit design, prototype fabrication, mass production and SMT assembly. As a reliable partner and world-class manufacturer, Qdos is certified with ISO9001, ISO/TS16949, ISO14001, Sony Green Partnership and Canon Green Procurement.

We have launched a new product family, Molded Interconnect Substrates (MIS) after twenty years of excellence in FPC design and manufacturing. MIS technology redefines coreless IC substrates. This cutting-edge technology provides an innovative solution to BGA, QFN and fine pitch flip-chip semiconductor packaging.. 


  Products

  • FPC & IC Substrate
    TBD...

  • TBD

  • Coreless MIS Features
    antenna, grounding between adjacent terminals, round coils, SMT stud, wettable flank, toroid...

  • Antenna : Wireless design made easier!

    Grounding between adjacent terminals : Enhanced signal noise reduction!

    Round coils : Built-in inductor made easier!

    SMT stud : SiP PKG passive componet under fill made easier!

    Wettable Flank : Automotive solder fillet inspection made easier!

    Toroid : Enable micro motor / enhancing OIS performance!

  • Electro-Formed Substrate
    Mushroom structure...

  • Mushroom overhang structure for PKG EMC locking

    Thin profile (50 +/_ 15 um) enable ultra thin package

  • Ceramic Substrate
    DBC, AMB...

  • DBC : Al2O3 ceramic

    AMB : AlN, Si3N4 ceramic

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