Palomar Technologies

Palomar's 3880-II Die Bonder large area, flexible work envelope enables users to eliminate set-up changeover when working in high-mix, multi-process assembly environments. The 3880-II's modular design allows for virtually any kind of die presentation and die placement inputs, and automates the die attach processes most common in die attach assembly operations. Using a tightly controlled, closed feedback system, the 3880-II's die attach processes places components at 5um accuracy @ 3um repeatability using programmable attach methods of eutectic reflow, dynamic and steady state; epoxy adhesive, fluid dispensing and duabing/stamping; and flip chip thermocompression attach. Dies, components and materials such as preforms can be presented using wafer(s), waffle/gel pak, tape and reel and presentation methods, and then attaced using a wide selection of eutectic, epoxy or flip chip capability options. Substrates have similar flexibility in presentation, including on a carrier, stage or pallet. Consistency and reliability of equipment, with decades of process expertise make the Palomar 3880-II die bonder a complete automated assembly solution.  

Palomar’s 8100 Gold Wire/Ball Bonder and Ball/Stud Bumper’s large work area enables users to easily work within high-mix application environments while maintaining rigorous repeatability specifications at 8 WPS.  The Z-axis stroke of 20mm and compound Z-linear/Z-Rotary bond head design, gives the 8100 the unique ability to reach deep into packages and bond very close to walls. Multi-component, multi-level wire bonding is done without any set-up changeover. The versatility of the machine is demonstrated through its Au ball bumping capability, making planar ball bumps in a single step. The 8100 can be configured for batch load or automated loading and conveyors. Work stages ranging in size from 150mm x 100mm up to 300mm x 200mm, and 150mm wafer stages (wafer bumping) are bolt-on options available for all Palomar wire bonders. Palomar engineers will work with you to design tooling (for your parts) and while also develop a program that delivers a repeatable, automatic, high-yield result.

Singapore-based, Palomar Assembly and Contract Manufacturing Services provides rapid prototyping, process development and assembly-as-a service production for companies looking for quick-turn die attach, wire bonding and vacuum reflow services. Trusted globally by many of the largest companies in the world, high-quality, optimized results are possible because Palomar is not only the OEM of the Bonder and Vacuum Reflow equipment utilized in Assembly Services, but also the experts in process development, process optimization and application know-how. The programs, tooling and additional automation developed during your engagement with Palomar are transferrable to mass-production anywhere in the world. No minimum order quantities and no long-term contracts are required.  MNCs and SMEs from more than 50 different application verticals have leveraged Palomar Assembly Services to accelerate their go-to-market timeline and achieve mass production ahead of competition.  

Palomar's SST 5100 programmable vacuum pressure system achieved superior hermetic lid seal results by combining time, temperature and vacuum in a single chamber, single process method with Real Time Graphing of all Profile Runs. Using it's expertly tuned automated profiles and process expertise, Palomar's SST equipment and solutions can deliver very high-yield for high-reliability microelectronic devices. Typical end-market devices include those used in aerospace flight hardware, defense IR sensors, high-power industrial lasers and critical automotive sensing. The 5100 system also delivers exceptional void-free die attach capability by introducing over-pressure (pressure above atmospheric pressure) to the vacuum, temperature and time automated profile. The over-pressure is built into the automated profile process and introduced to force out voids in difficult applications, where <1% voiding is essential. Fluxless processes are also possible, and often necessary due voiding requirements and environmental regulations. In lieu of flux, SST will utilize formic acid or forming gas. All heating elements in SST systems are transmitted through graphite tooling using both radiant and resistive heating methods. The graphite tooling is precision-machined by SST and designed for the specific size, type, material composition and performance requirements of device being bonded or sealed. SST systems range in temperature from 450'C up to 1000'C, vacuum levels from 10^-4 to 10^-7 torr, and over-pressure up to 40 psig. An array of options including Getter Activitation, Residual Gas Analyzers, Moisture Level Recording, and UPH enhancers.