Saultech Technology Co., Ltd.

GB-20S is a panel-level high-speed die bonder that operates on the principle of batch die bonding. It pre-arranges the die on the bonding head before performing the entire group bonding process, achieving high-speed die bonding performance on large substrates. It can operate on substrates pre-coated with adhesive material, solder paste, flux, or double-sided adhesive film. The die tape frame can automatically load and unload, while the substrate requires manual loading and unloading.

 Adopts the operation mode of pre-arranging and then bonding the entire group of dies, meeting the high production capacity requirements on large substrates. • The bonding compression time is relatively sufficient compared to single die operations, which can improve adhesive reliability. • The main spindle adopts linear motor drive to maintain long-term accuracy in picking and placing. • Immediate confirmation of picking status after picking to eliminate potential subsequent damage caused by picking errors. • Immediate inspection of placement results after pre-arrangement. • Flip and non-flip dual-use.

Product Specifications:

The purpose of the ST-663 is to retrieve individual grains adhered to a film based on mapping data, sort them into designated bins, and neatly arrange them on the surface of a substrate. The substrate needs to be pre-coated with adhesive film, and the placement of grains must have alignment marks.

• Patented Wafer & Substrate vertical working position to reduce dust contamination.
• Ultra-short arm PP Arm to reduce mechanical vibration, improving stability in productivity and alignment accuracy.
• Adoption of a non-protruding film picking method to reduce impact force on the chips and minimize chip damage.
• After retrieving the chip, it is then positioned, and alignment with the alignment marks on the substrate is performed. The placement accuracy is ≤ ±10μm, and the angle accuracy is ≤ ±1° (3 sigma), with chip sizes ranging from 0.25mm to 1.2mm, under the condition of enabling the bin table θ angle compensation function (ensuring chip cutting appearance integrity).
• The system also includes Pick Die abnormal CCD image identification inspection and position compensation.
• With a 4 Heads Index structure, the Cycle Time is 175ms (for chip sizes between 0.25mm and 1.2mm), under the condition of the bin table θ not rotating.

ST-812R is a machine that can arrange cut semiconductor wafers on a film or adhesive substrate as required. It has the ability to achieve high speed and precision in picking and placing, and can retrieve and place the wafer on the film according to wafer mapping data. The wafer feeding mechanism can be used with a tape frame for 8" frame production, while the bin feeding mechanism, equipped with a change kit and a large-area vacuum flat system, can be used for 320mm x 324mm frame or substrate production.

• High productivity, precision, and stability:
• Disco 8" frame on the wafer end
• Automatic loading and unloading on the wafer end
• Maximum square placement range on the bin end: 290mm x 290mm, compatible with both frame and substrate
• Bin end equipped with a large vacuum flat suction system, adjustable flatness, and continues to function even during power failure to ensure uninterrupted operation
• Vertical frame design minimizes dust contamination and shortens pick-and-place distance
• Easy replacement of nozzles, top pins, and caps
• Simple structure for easy maintenance.

Product Specifications:

• Wafer size: 8″ (blue film or UV film)
• Chip size: 0.15mm x 0.15mm, T ≥ 100um, ≤ 500μm
• Cycle Time:≤144ms for chip size: 0.15 x 0.15mm ~ 1.0 x 1.0mm, spacing: ≤1.2mm. Cycle Time≤180ms for chip size: 1.0 x 1.0mm ~ 2.0 x 2.0mm, spacing: ≤2.2mm. Cycle Time≤240ms for chip size: 2.0 x 2.0mm ~ 3.5 x 3.5mm, spacing: ≤4.2mm
• Placement Accuracy:Initial point position and alignment symbol position error: ≤ ±50μm.Relative accuracy based on the aforementioned cycle time: ≤ ±15μm & θ ≤ ±1 degree, 99.9%, CPK 1.33.Absolute accuracy based on the aforementioned cycle time: ≤ ±25μm
• Wafer table: Disco DTF2-8-1, maximum expansion depth 12mm, adjustable with interchangeable fixtures. Working range: 8-inch Ø216mm @ Ø15mm cap