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AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd

Kulim,,  Kedah 
Malaysia
http://www.ats.net
  • Booth: 3813

Overview

AT&S is a leading global manufacturer of high-quality IC substrates and printed circuit boards as well as a developer of pioneering interconnect technologies for the core areas of mobile devices, automotive & aerospace, industrial, medical and high-performance processors for VR and AI applications. AT&S has a global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). A new high-end production facility for IC substrates is currently being ramped up in Kulim, Malaysia. A European competence center with connected series production for IC substrate technologies is being built in Leoben. Both sites will start production in the financial year 2024/25. The company employs more than 14,000 people. Further information can be found at www.ats.net


  Products

  • IC SUBSTRATE (ABF SUBSTRATE)
    Modern microchips like processors in smartphones combine billions of transistors in tiny spaces. IC (integrated circuit) substrates connect the microchips to the circuit board, on which memory, power supply and other vital system components are mounted...

  • Sophisticated microchips, which rely on substrates to enable integration into electronic systems, aren’t the sole preserve of PCs and servers in data centers. The 5G networks we use to surf the internet with our smartphones also need powerful electronics to leverage their advantages. The same goes for supercomputers that are used for scientific purposes, such as climate simulations or the development of new drugs. Some high-tech applications like the 3D scanning of an area rely on complex sensors that require high-performance chips and substrates.

    Product benefits at a glance:

    • AT&S substrates offer top performance and proven reliability.
    • We can adapt our substrates flexibly according to our customers’ wishes.
    • The high degree of flexibility allows us to come up with new solutions for changing requirements quickly.
  • HIGH FREQUENCY AND HIGH-SPEED PCBS
    The interconnected nature of everyday life requires the wireless transmission of huge amounts of data via high-frequency signals. Electronic systems that process high-frequency signals need the shortest possible conducting paths to function efficiently...

  • Besides 5G and future 6G mobile networks, many other application areas rely on the effective processing of high-frequency signals. High-resolution radar, laser sensors and satellite communication can be implemented with maximum efficiency using high-frequency printed circuit boards from AT&S.

    Product benefits at a glance:

    • Allows antennas and signal processing to be integrated into a single package.
    • The compact design ensures shorter signal pathways.
    • Low losses during signal transmission and processing.
  • EMBEDDED COMPONENT PACKAGING PCBS
    Our printed circuit boards with ECP® technology are the culmination of years of development in the field of miniaturization. This allows our ECP® PCBs offer more functions than a conventional board of the same size in high-tech applications....

  • ECP® printed circuit boards are important for different areas of the electronics industry. Their thin design makes them ideal for use in ultra-thin smartphones and tablets. Tiny communication modules can be enclosed in smart rings and other unusual form factors that open up new possibilities for consumer electronics.

    Speaking of smartphones: our highly miniaturized circuit boards enable larger, longer-lasting batteries and chargers with ECP® technology can charge these batteries faster. Electronic access controls, data centers, smart factories and medical technology all benefit from the reduced system size and enhanced reliability of ECP® PCBs.

    Product benefits at a glance:

    • ECP® printed circuit boards enable compact systems and smaller devices.
    • Moving components inside the printed circuit board offers better protection, while freeing up room on the outer layers.
  • TEST AND REFERENCE BOARDS
    Quality control is a major topic in the semiconductor industry. Processors and other chips are routinely checked after production using IC testers. Our test boards are complex adapters that allow even the finest structures on a microchip to be probed....

  • Product benefits at a glance

    • Highly complex microchips can be checked with AT&S test boards.
    • Due to the high number of layers, many chips can be checked at the same time.
    • Reference boards save time and make it possible to develop the ecosystem for a chip at an early stage of development.
  • SEMI-FLEX PCB
    The materials in semi-flexible PCBs usually differ from those in flexible PCBs, but thin FR4 standard material can be used for many applicationscost-effective alternative. Semi-flexible PCBs can be bent to install and produced at lower cost....

  • Because they can be designed to fit almost any kind of available space, semi-flexible printed circuit boards are an especially appealing option in the automotive industry and for machine-to-machine communication, which is becoming increasingly important in manufacturing.

    Product benefits at a glance

    • Best solution for installation in static positions after bending and fixating.
    • Mass production experience in automotive and data storage applications.
    • We offer stress simulations to provide the optimal layout for flexible circuitry.
  • ADVANCED INTERCONNECT SOLUTION SERVICES
    AT&S’s “Advanced Interconnect Solution Services” (AISS) offers technical assistance options that go far beyond conventional PCB manufacturing, including support for customers in designing systems and virtual product development....

  • Services are organised in five different areas

    The PPS Team (Product & Process Simulation) offers simulations at the highest technical level for a variety of different areas. Virtual tests are conducted to determine how PCBs react to warping or twisting, how thermal load is distributed and how reliable a system is under realistic conditions.

    The HDC Team supports our customers in complex technical tasks such as designing new circuits.

    Our RF Team dedicates itself to the latest concepts in RF design, for example the integration of RF structures of passive filters and antennas. They also carry out complex impedance and loss simulations in order to improve the signal line.

    Our Product Development Team (PDS) provides customers with assembly services carried out by proven partners. In addition, the team coordinates AISS services ranging from design, simulations, RF optimization and assembly to PCBA testing conducted by our FTD Team (Functional Test Development). This ensures fast and cost-efficient product and module development for our customers.

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