Develop the chips of the future with SET Flip-Chip Bonders.
Overview
Based in France, SET -Smart Equipment Technology- is a world leading supplier of High Accuracy Flip-Chip Bonders and versatile NIL solutions.
Since 1975, we have been accompanying laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components.
With Flip-Chip Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the high flexibility of its equipment.