SKD308H Pick&Place TestHandler
It is suitable for multifunctional testing and sorting, to incorporate thermal (Tri-temp), vision, sorting and automation options to meet existing and future IC handling needs.
Application:
It design to perform the high-throughput pick&place handling of IC components, MSOP, QFN , QFP, SIP, LGA, BGA, CSP, SIM, IPM, IGBT, Memory(3x3-55x55mm), etc.
Advantages:
1.Bilateral Drive Structure Design: high precision, fast speed, long service life.
2.Multi-nozzles Design: each nozzle Z-axis motor is controlled independently, that can support 2x4 pick&place nozzles, and the PickArm is designed in cross-beam structure , with a smooth center of gravity and a stable structure. Mechanical architecture is based on full linear motion technology, with controlled axis acceleration and speed, to guarantee fast and accurate handling.
3.Floating indenter with ball bushing structure: provides higher precision testing and high test yield.
4.Intelligent System: It ensures a fully reliable test of packages in cold, hot or ambient test conditions.