Low Pressure Molding Solution (LPMS) 800H is a vertical injection machine designed to encapsulate & protect PCBA with sensitive electronic parts against moisture, dust & vibration.
Low pressure molding encapsulation is an ideal alternative for potting and conformal coating in terms of handling and efficiency, by injecting appropriate volume of melted resin material into a precision mold to fill the cavity with PCBA parts. Within 5 minutes, the parts would be cool down and ready to move toward the next process.
The LPMS 800H has safety system such as light curtain and dual palm buttom comes as standard, ensuring operator safety. Equipped with 7 inch touchscreen multi-language interface makes it user-friendly.
To ensure effective operations, the LPMS 800H has three (3) Heat Control Zones for more precise control in melting polyamide or polyolefin resins into a mold. With the addition of Air Over Oil Cylinder (AOOC) & Mechanical Ejection System (MES), it gives more clamping force for larger PCBA parts and to eject the parts after molding for better handling.
For more information about LPMS 800H or Low Pressure Molding inquiries, please contact our sales representative, Jeremy Ang (+6019-669 2602).