Adhesive products cover silicone, epoxy, acrylate, and polyurethane, widely used in portable smart devices and related accessories, such as mobile phones, IPad, notebook computers, housings, power adapters, wires and FPC, communication equipment, LED Lighting, new energy power batteries, solar modules.
The silicone product line mainly covers one-component room temperature vulcanized silicone rubber (RTV), one-component heat-cured silica adhesive, two-component additive potting silica adhesive, and two-component condensation type silica adhesive, which are mainly used for irrigation of various devices or PCBs. Sealing, surface coating of PCBA, sealing of the outer casing, thermal bonding of components, etc.
The epoxy resin product line includes one-component thermosetting and two-component curing. It is typically used for underfill of mobile phone BGA/CSP, solder joint reinforcement of components on FPCB, bonding of magnetic components, chip and heat sink. Group of thermal bonding, module potting, etc.
Acrylate products include one-component UV curing, one-component anaerobic curing, two-component curing, and primer curing. They are widely used for component encapsulation on FPCB, reinforcement of solder joints, bonding of lenses to PCBs, and thread locks. Solid, magnet and T-iron bonding, shell structural bonding, thermal bonding of the chip and heat dissipation module.
Polyurethane adhesives include one-component moisture-curing hot melt adhesives and two-component PUs. It is mainly used for structural bonding of an outer casing, bonding, and sealing of glass and metal, structural bonding between the electric core and electric core, and bonding of electric core and side plate.
A new generation of low-temperature lead-free solder paste
Low-temperature reflow can greatly increase production yield while reducing power consumption and carbon emissions. It is the trend of the next generation of electronic assembly solutions. It can be applied to the production of personal consumer electronic products such as computers and home appliances. At the same time, the low-temperature reflow process can completely abandon the wave soldering process, thereby greatly reducing production costs and improving product reliability.
DW-1000 solder paste is a new generation of low-temperature lead-free solder paste. Using the patented LTS037 alloy, it can be reflow soldered at 170 degrees peak temperature. It can completely solve the NWO defect caused by the high temperature of the current SAC305 solder paste during the soldering process.
We participated in the project of iNEMI and performed well in various evaluations. It is the best choice for the next generation of low-temperature assembly solder.
SMT lead-free solder paste
The lead-free solder paste can meet the needs of the SMT process. It has been widely used in the production of notebook computers, personal communication products, household appliances, etc., and has been recognized by customers such as SONY and HP.
We developed the solder paste formula to provide high ICT test pass-through rate, anti-NWO and HoP, room temperature storage, low void, ultra-high impedance, ultra-fine inkjet coating and other application characteristics for different needs of customers. Cream products. The company's engineers will work with customers to provide customized solutions to meet the best process requirements.
We are committed to the research and development of intelligent electronic auxiliary chemicals, energy, and environmentally friendly chemicals. The products include electronic cleaning agents, surface treatment agents, coatings and protective chemicals, energy, and environmental additives, products. It involves many fields such as communication equipment, automobile industry, machinery manufacturing, energy, and environmental protection.