TESEC (M) SDN. BHD.

T4530-T
LT4530T is the latest model which features a high throughput capability, 8 sites , hot and cold temperature testing, and high-frequency contacts. High utilization rate of this handler is achieved by thorough preventions of jams and lead deformations. With the high throughput and the high reliability, LT series is highly evaluated globally.

LT4530-D
This version features 4 sites and hot temperature testing. High utilization rate of this handler is achieved by thorough preventions of jams inherited from the LT9900.

Feature
LT4530-T
■Features
・High Throughput
The maximum of 28,000 UPH with 8 sites is enabled by 0.9 seconds of index time with no downtime at loader/unloader
・High utilization rate
This is achieved by thorough prevention of jam and lead deformation.
・Wide Range of Temperature Test Capability
−55℃ to 155℃

LT4530-D
■Features
・High Throughput
The maximum of 18,000 UPH with 4 sites is enabled by 0.6 seconds of index time with no downtime at loader/unloader.
・Hot Temperature Test Capability
  30℃ to 155℃

High speed indexing of the devices on the ring are supported by precise device positioning information and optimized probe-pin contact pressure that are ensured by the positioning (x, y, z, θ) compensation before testing with visual inspection system.

Feature

・High throughput 
・High withstand load and high thrust table 
・Maximum Strip Attachment Area: 300 mm(L) × 300 mm(W) [⌀300 mm for WLCSP]
・LOT control with barcode/2D code reader 
・Easy device type conversion — test socket replacement and display screen setting
・Auto-cleaning function of socket with programmable timing
・6/8/12 inches ring conversion 
・SEMI S2/S8 compliant
・SEMI G85 compliant
・SECS/GEM compliant
・Highest test temperature: 155℃
・Lowest test temperature: −45℃
・Upgrade from the ambient temperature system to the temperature control system is available at the installed location.

Feature

・Utilized the measurement technology of both logic IC and discrete power device testers.
・Maximum 2.2kV/67A (max 200A) measurement capability. Expandable by adding external units.
・Supports two device parallel measurements.
・Easy language-less test program creation (fill-in-the-blank method)
・High-speed leakage current measurement
・Various bias application waveforms and timing

Inheriting TESEC's strength in high-voltage and high-current measurement technology, this tester has significantly increased productivity compared to conventional testers by simultaneously testing multiple chips on single touch down.
One-Pass test of Avalanche measurement*1 is supported to meet the demand of today's market.
（*1） Dedicated measurement unit, which is only for 8 parallel model, is required. Also, it may not be applicable depending on the test condition and measurement environment.

Feature

・Improved cost performance through simultaneous measurement of multiple chips (8 / 16 parallel)
・DC measurement and Avalanche measurement in 1 test system
・Significantly shortened the data transmission time by LAN connection
・Faster relay switching shortened the measurement time
・Parallel measurement is stabilized by our accumulated measurement technology (Max 2 kV / 20 A)
・Voltage and Current Limitation settings reduce the load on the probe pin
・Automatically calculate the number of chips to be measured simultaneously so that total required current of the chips to be lower than the predetermined maximum applicable current value (current capacity of the prober chuck)

As a high-speed sorting machine compatible with the wafer ring size of up to 12 inches, it helps to achieve a significant improvement in the efficiency of inspection process.
Equipped visual inspection and handling systems satisfy the stringent standard of WLCSP and Wettable Flank-plated QFN.
Proven track records of this handler include the contributions to the automotive semiconductor and the installation to the class 10000 cleanrooms (ISO 7).

Feature

・High Throughput (30,000 UPH)
・Easy device management with recipes
・Substantial contribution to High-Mix Low-Volume Manufacturing. Slight change in package size does not require any conversion kit. Even when that is not the case, changing a conversion kit requires a minimum effort.
・Automatic calibration function supports the productivity and the maintainability by correcting the motion of every section based on the accurate position information of device transfer collets.

High UPH (14,400 pcs.) is accomplished while keeping 120 seconds of Soak time for TO220 and D2PAK by implementing at a maximum of 8 test sites (when socket contactor is used). Temperature control accuracy of ±2℃ is guaranteed in the range of −60℃ to 0℃ for Cold Temp as well as 50℃ to 175℃ for Hot Temp.

Feature

・High throughput (14,400 UPH)
・−60℃ to 175℃ temperature range
・High current testing using TESEC's original contactors
・Tube packages are protected from heat deformation and dew condensation by cooling mechanism and heating mechanism respectively.
・Tube Opener mechanism is equipped to stabilize the tube storing
・Large amount of Soak is enabled by the rotating multi-tracks equipped at each lane
・SECS/GEM compliant