Since we started in 2018, OCAS Systems designs and manufactures innovative, leading-edge and cost-effective automated vision inspection equipment and packaging machine that utilises its expertise in applying latest software technologies for the semiconductor and electronics packaging industries. In 2023, OCAS Systems has entered into a strategic joint venture with a prominent company, TQC Precision Engineering Pte Ltd to jointly develop a cutting-edge 8” & 12” wafer prober. The aim of this collaboration is to combine the strengths and expertise of both companies to create a revolutionary wafer prober that addresses the increasing demands of the semiconductor market. OCAS Systems serves customers from semiconductor Outsourced Assembly and Test (OSAT) and Original Design Manufacturer (ODM) around the world.
Introducing our our state-of-the-art 8″ and 12″ wafer probers, setting the benchmark for precision and performance in semiconductor testing. Built on a robust solid granite base for unparalleled stability. OS6000 boast a sophisticated linear motor system that ensures swift and highly accurate positioning. The introduction of MicroTouch (soft touchdown) technology guarantees delicate yet precise wafer handling ensures delicate handling of wafers, safeguarding against potential damage.
The closed-loop system, coupled with our proprietary Active Vibration Control (AVC), a feature that mitigates any disturbances and vibration (external or internal), maintaining an utmost optimal testing environment. What sets our probers apart are the unique software features that elevate performance to new heights, offering intuitive control and unmatched flexibility. With a focus on innovation and reliability, our wafer probers redefine precision in semiconductor testing.
osRRS+ is design to fully automate Post Seal Vision Inspection of Reel to Reel output. It is flexible, easy to operate and provides fast and consistent output with high inspection accuracy.