Spring Series
It is applied on the final polishing step of CMP, cleaning or reclaim process to achieve an extremely fine and plain surface. The workpiece can be silicon wafer, SiC, GaAs, sapphire, quartz, ceramics and etc.
SanＦilm Series
This series are special for the final polishing step of CMP. Especially, it can be used high precise requirement for semiconductor advanced process.
Supereme Series
This series are applied on the various semiconductor substrates for the coarse or middle polishing process. The substrates can be silicon wafer, SiC, GaAs, sapphire, quartz, ceramics and etc.
Template
It is a carrying wafer and soft backing pad, of which sponge-like cushion provides the best protection for kind of wafer.