Overview
About UniSiC
Innovation leader in precise testing of third-generation power semiconductor devices
- Provide third-generation wide bandgap SiC and GaN power semiconductor device testing equipment and high-precision electronic measurement instruments
- Comprehensively cover wafer level testing (Chip Probing), chip level testing (Know Good Die), discrete/module level testing (Final Test), and system level testing of power semiconductors. Meet various scenario requirements both in laboratory and in production line
- Widely applied in IDM, EV enterprises, Tier1 and device packaging companies to assist in high accuracy, high reliability, and high efficiency testing