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Wuxi Unicomp Technolog Co.,Ltd

Wuxi Shi,  Jiangsu Sheng 
China
https://www.global-xray.com
  • Booth: 4119

Unicomp X-Ray,A leader in the intelligent X-Ray inspector

Overview

Unicomp Technology was incorporated in 2002. It is a national level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equipment. Unicomp has become the leading enterprise in domestic X-ray industry. This technology is widely applied in EMS, IC, Semiconductor, Solar Photovoltaic, LED, Lithium battery,Connector, Automotive Parts, Wheel, Tires, Pressure vessel industry etc.

Presently Unicomp has submit a total of over 500 patents with more than 400 authorized. Unicomp has obtained numerous management system certification, such as ISO 9001 quality management system, ISO 14001 environmental management system, OHSAS18001 occupational health & safety management system, as well as ISO27001 information safety management system.

Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, JABIL, Elcoteq, Philips, GM, Bosch,and so on just to name a few.

Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 50,000㎡ respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing.The company has also penetrated into the international market with sales and service support in USA, Canada, Mexico, Brazil, Germany, United Kingdom, France and so on.This international connection has helped Unicomp to be recognized as a Global Force in today’s X-ray industry. Today “UNICOMP” is a hallmark brand in the industry both at home and abroad.


  Products

  • Semiconductor Lead Frame In-line X-Ray Inspection
    Mainly used in Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection...

  • SMT/PCBA Package type:

     Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection

    Semiconductor Package type:W/B、IC、F/C...
    Defect type:Void、Open、Short、Sweep、Solder ball...
    Other areas Battery, IGBT...
  • CX3000 DesktCX3000 Deskop X-Ray Inspection Machine
    Widely applied for Electronics components in Tape & Reel, JEDEC Tray and Tube package, PCBA, BGA, CSP, Flip Chip, LED, Fuse,
    Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,...

  • Widely applied for Electronics components in Tape & Reel, JEDEC Tray and Tube package, PCBA, BGA, CSP, Flip Chip, LED, Fuse,  Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components,  Photovoltaic Industry, etc.
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