The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

Semiconductor Back end Visual Inspection 

- MicroVision Technology throughly inspects the microscopic and complex semiconductor packaging process. 

INTEKPLUS's excellent Vision Technoligy, selected by Global Semiconductor manufacturers, provides the best inspection solutions in the Semuconductor back end visual inspection proces. 

Semiconductor Mid End Visual Inspection

INTEKPLUS's WSI (White Light Scanning Interferometer) 3D optical system is an optimal inspection solution for fine pitch bumps required for high-end products. FC-Substrate, FO-PLP, Wafer, and the performance of the equipment have been verified through bump inspection of various products.

INTEKPLUS is responding by partnering with global leader companies that are continuing various trials and developments, and the experience is the best Spec. It is becoming the foundation for realizing further customer satisfaction.

We are providing solutions for:

•       ATE hard docking, manipulators, and trolleys 

•       Automated load board changers 

•       Automated probe card handling trolleys & storage 

•       Probe Card Analyzer Adaptors and Fixtures

• Handler conversion kits

-  Shenzhen Huaxin Intelligent Equipment Co., Ltd. is a professional enterprise specializing in the research and development, production, sales, and service of semiconductor wafer-level packaging equipment. We are committed to becoming a global one-stop supplier of high-quality semiconductor wafer-level testing, sorting, inspection, and panel-level packaging solutions, contributing to the revitalization of China's independent chip industry.

- The company has its headquarters in Shenzhen, a subsidiary in Malaysia, a production base in Huizhou, and various branch service networks.

- The main products are advanced testing equipment, WLCSP specialized equipment, Panel-level testing equipment, Fanout packaging equipment, and SIP testing specialized equipment.

Semiconductor Advanced Packaging

Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach.  We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates.  Bring us your soldering or curing challenge, and our experienced engineers are ready to provide your customized solution.

Ball Attach

A typical ball attach process for requires a stable reflow process compatible with a clean room environment.  Heller’s horizontal reflow ovens satisfy both of these.  With a large global installed base covering North America, Korea, Taiwan, and Southeast Asia, Heller reflow ovens have a proven track record for ball attach applications.

Bumping and Die Attach

Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes.  For devices with larger bump pitches, standard reflow ovens can be used effectively for both bumping and die attach. This becomes more challenging at finer bump pitches due to difficulties with cleaning residual flux.  In these cases a formic acid reflow process is appropriate, which does not require applied flux.  Click here for more information.

Heller offers ovens which combine formic reflow acid with a vacuum process, or vacuum formic acid reflow (VFAR).  VFAR has been shown to be beneficial with fine pitch bumping applications by providing improved bump co-planarity, decreased solder wicking, and reduced solder voiding.  More formic reflow information.

Underfill Curing

Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing.  Heller curing ovens have cleanroom and full automation options and are suitable for high volume manufacturing.

Heller vertical curing ovens (VCOs) have a vertical architecture and require only a small amount of floor space, ideal for cleanroom environments where floor space is at a premium.

As device reliability requirements increase, low void underfill curing is becoming more essential.  Heller’s pressure curing ovens (PCOs) solve this issue by using pressure throughout the cure cycle to shrink and eliminate underfill voids.

TIM/Lid Attach

Semiconductor lid attach with thermal interface materials require a void free connection to ensure optimal heat dissipation ability.  Heller offers 3 solutions of this application: pressure curing ovens (PCO), pressure reflow ovens (PRO), and formic reflow ovens.  All three solutions have proven void removal capabilities, so let us about your specific application for recommendations on which is best for your use case.  You can read more about TIM attach solutions in this recent paper published by Heller at ECTC 2022.

Glass Substrates

Heller has experience with handling glass substrates, including glass wafers and panels (up to 600mm).  Large panel handling can be incorporated into both horizontal and vertical format ovens.