* Process to be applied
- Deep trench clean
- Post CMP
- Post hard mask deposition
- Post contact / Via etch
- Pre barrier metal deposition
- Wafer recycle
- Pre EPI deposition
- Pre ALD deposition
* Features & Specifications
- Up to 12 chambers, Up to 375WPH
- Double-sided cleaning, up to 5 cleaning chemicals
ex) DHF, SC1, SC2, DIO3, BOE, Solvent, HF/HNO3
- 2-chemical recycling capability
- Integrated chemical supply module with inline mixing
- Enhanced drying technology with hot IPA
- Footprint : 2.35m * 6.7m * 2.85m (W * D * H)