Chizhou Dinghong Semiconductor Technology Co. LTD

In Molding pricess,some components of molding compound and releasing agent are oxidated and attached to the mold surface in high temperature,and make the residue difficult to remove.If not remove in time, not only cause the diffculties of mold release and the defects of package appearance,but also damage the surface of the die cavity.

1. Cleaning Rubber Sheet ST-QM 8001:

Cleaning rubber sheet is used to remove epoxy stains formed during packaging in the cavity or surface of mold.

2. Wax Rubber Sheet ST-RM 8001:

Wax rubber sheet is the composite rubber that contain paraffin and other high polymer. It is used to lubricate and protect surface of the mold after cleaning.

We provide all kinds of cutters for wire bonding equipment to cut wires after the second bonder of the aluminum wires or aluminum ribbon is completed. The design of the cutters and the selection of the material can not only meet the requirements of the customers for the service life, but also meet the needs of the customers on the appearance, depth and width of the cut marks.

1. OE7200 Cutter (Slotted):

2. OE7200 Cutter (Slotless):

3. OE360 Cutter:

4. H&K Cutter:

5. F&K Cutter:

6. ASM Cutter:

7. Aluminum Cutter:

8. Supersonic Wave Cutter:

9. The Old Cutter:

We provide all kinds of wire guides for wire bonding equipment delivering wires to the working parts. It is researched and developed independently by high pressure injection molding of polymer materials, and through strict control of the production process, to ensure the product consistency and wear resistance.

1. 7200 Wire Guide:

2. 360A Wire Guide:

3. 360B Wire Guide:

4. ASM Wire Guide:

5. H&K Wire Guide:

6. Ribbon Guide:

7. F&k Wire Guide:

1. Rubber Tip

We provide rubber tips for die bonder, the design of which considers the rubber material characteristics and the performance requirements for the tips in the production process of semiconductor industry, to meet customer requirements for the temperature resistance, abrasion resistance, and expansion coefficient pf the tips and to improve the back suction problems of the tips in  use.

2. Ejector Needle

We provide all kinds of ejector needles, including metal ejector needles and metal-plastic combined plastic ejector needles with a variety of designs. In technical specifications we can not only provide standardized sizes to meet the mainstream market die bonders, but also accept customer customization.

3. Needle Cap

We can provide all kinds of needle caps for the mainstream equipment, and accept customer customization.

4. Wire/Ribbon Tube

We provide various sizes of wire tubes from the reel to the working parts. The material selected for the wire tubes has enough anti bending ability, so that when the wiring has a certain amount of tension, it can still maintain a relatively fixed shape and avoid serious quality problems such as unqualified arc and even cold solder joints. In the inner wall of the wire tubes there is a smooth coating, to ensure that the wire tubes cannot be scratched when the aluminum wires wire, and at the same time to ensure that the wire tubes not easy to dip aluminum.

5. Epoxy Nozzle

We provide various forms of epoxy nozzles according to the different equipment configuration and product requirements, including single needle, multi needle, multi holes and so on; the installation position can be standardized specifications designed for mainstream market die bonders, but also fully customized. All forms of epoxy nozzles can perfectly meet the quality control requirements for complete coverage and zero empty of silver colloid. Optimized design flow can also make the flow of the silver colloid stable and reliable.

6. Clamp Finger

The claw has an auxiliary effect on the wire bonding equipment, which is used to fix the lead frame in wire bonding. We select high life materials and processing, to ensure the mechanical strength and service life of the claw. We can provide standardized claws, and also can design according to the specific issues of customers.

It is used in semiconductor chip packaging industry aluminum wire or aluminum strip welding process of bonding equipment. At one end of the steel nozzle, the contact aluminum wire is used for welding. The contact aluminum wire end includes the edge of the joint between the bonding groove and the surface size of the key and groove on the end of the steel nozzle. When welding line process key fit, contacts the bonding grooves can be directly on the aluminium wire end friction extruded aluminum to chip, steel mouth converts electrical energy into mechanical energy, through steel mouth is passed on to the aluminum wire, aluminum wire and the chip intersect welded together. The shape can be based on different applications and can be roughly designed to be aluminum and aluminum.

1. H&K Wedge:

2. CYB Wedge:

3. OE Wedge:

4. FK Wedge:

5. COB Wedge:

6. Semi-automatic Wedge:

7. Aluminum Ribbon Wedge:

We provide different cleaning solutions to die sawing, de-flux, de-tape and tin-plating process in semiconductor packaging industry. Our products include dicing surfactant, laser cutting protective solvent, de-flash cleaning solvent, de-flux cleaning solvent and other chemicals.

1. Dicing Surfactant BST9208:

BST9208 is used with DI Water in the wafer dicing process, which can prevent static electricity, remove dirt and debris, effectively reduce DI Water stress. Additionally, it allows DI water to quickly penetrate into the back of the wafer, and reduce back chipping.

2. Low Temperature De-flash Solvent BST9246:

BST9246 is mainly used in the de-flash process of integrated circuit and discrete device packaging. By removing excess molding flash after packaging, the plating appearance of the product can be effectively improved, the plating rework rate can be reduced, and the reliability of the product can be improved.

3. De-flux Solvent BST9207:

BST9207 is used to remove flux, solder paste and other residues on PCBA, packaged devices and power devices. It is suitable for ultrasonic steam bath cleaning process.