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Chizhou Dinghong Semiconductor Technology Co. LTD

Shenzhen,  China
http://www.futurehover.com
  • Booth: 1820

Welcome to booth 1820, to know more about DH Semi!

Overview

DH Semi, as a crucial branch of Future Hover Industrial Group, was founded in 2020 to integrate the productive forces of the group along with a sole vision to provide better alternative solutions to semiconductor packaging industry through its three main product roadmaps, namely precision tools, fine chemicals and modified rubber.  

Under DH Semi, there are three main business units, namely Future Hover, Bestech and Solitech. Future Hover mainly provides all kinds of precision tools for die attaching, wire bonding and testing process, such as wedge, cutter, wire guide, ejector needle and many other consumbles. Bestch focuses on providing different cleaning solutions in die sawing, de-flux, de-tape and plating process, whose products include dicing surfactant, laser cutting protective solvent, solder cleaning solvent and de-flash chemical, while Solitech concentrates on manufacturing modified rubber for molding process. 

At DH Semi, by taking the accumulation, innovation, quick response and win-win as our core values, we endeavor ourselves to improve our technology ability constantly so as to follow closely with customer's technogical innovation. With decades of cooperation with global top enterprises, both our products and service have stood up to the test in high-quality, stability and quick response. We're very happy to be here to present both our company philosophy and products to our old friends, and we're looking forward to make some new friends by this opportunity. 


  Products

  • Modified Rubber Sheet
    Cleaning rubber is used to remove epoxy stains formed during packaging in the cavity or surface of mold, while wax rubber is used to lubricate and protect surface of the mold....

  • In Molding pricess,some components of molding compound and releasing agent are oxidated and attached to the mold surface in high temperature,and make the residue difficult to remove.If not remove in time, not only cause the diffculties of mold release and the defects of package appearance,but also damage the surface of the die cavity.

    1. Cleaning Rubber Sheet ST-QM 8001:

     

    Cleaning rubber sheet is used to remove epoxy stains formed during packaging in the cavity or surface of mold.

    2. Wax Rubber Sheet ST-RM 8001:

    Wax rubber sheet is the composite rubber that contain paraffin and other high polymer. It is used to lubricate and protect surface of the mold after cleaning.

  • Cutter
    The cutter is the common accessory which is used to cut the aluminum wire or ribbon after the second solder joint in wire bonding process of semiconductor industry....

  • We provide all kinds of cutters for wire bonding equipment to cut wires after the second bonder of the aluminum wires or aluminum ribbon is completed. The design of the cutters and the selection of the material can not only meet the requirements of the customers for the service life, but also meet the needs of the customers on the appearance, depth and width of the cut marks.

    1. OE7200 Cutter (Slotted):

    2. OE7200 Cutter (Slotless):

    3. OE360 Cutter:

    4. H&K Cutter:

    5. F&K Cutter:

    6. ASM Cutter:

    7. Aluminum Cutter:

    8. Supersonic Wave Cutter:

    9. The Old Cutter:

  • Wire Guide
    Wire guide is used to conduct wire during wire bonding....

  • We provide all kinds of wire guides for wire bonding equipment delivering wires to the working parts. It is researched and developed independently by high pressure injection molding of polymer materials, and through strict control of the production process, to ensure the product consistency and wear resistance.

    1. 7200 Wire Guide:

    2. 360A Wire Guide:

    3. 360B Wire Guide:

    4. ASM Wire Guide:

    5. H&K Wire Guide:

    6. Ribbon Guide:

    7. F&k Wire Guide:

  • Other Consumable parts
    We also produce other consumble parts used in semiconductor packaging industry, including rubber tip, ejector needle, needle cap, wire/ribbon tube, cutter rest, epoxy nozzle and others....

  • 1. Rubber Tip

    We provide rubber tips for die bonder, the design of which considers the rubber material characteristics and the performance requirements for the tips in the production process of semiconductor industry, to meet customer requirements for the temperature resistance, abrasion resistance, and expansion coefficient pf the tips and to improve the back suction problems of the tips in  use.

    2. Ejector Needle

    We provide all kinds of ejector needles, including metal ejector needles and metal-plastic combined plastic ejector needles with a variety of designs. In technical specifications we can not only provide standardized sizes to meet the mainstream market die bonders, but also accept customer customization.

    3. Needle Cap

    We can provide all kinds of needle caps for the mainstream equipment, and accept customer customization.

    4. Wire/Ribbon Tube

    We provide various sizes of wire tubes from the reel to the working parts. The material selected for the wire tubes has enough anti bending ability, so that when the wiring has a certain amount of tension, it can still maintain a relatively fixed shape and avoid serious quality problems such as unqualified arc and even cold solder joints. In the inner wall of the wire tubes there is a smooth coating, to ensure that the wire tubes cannot be scratched when the aluminum wires wire, and at the same time to ensure that the wire tubes not easy to dip aluminum.

    5. Epoxy Nozzle

    We provide various forms of epoxy nozzles according to the different equipment configuration and product requirements, including single needle, multi needle, multi holes and so on; the installation position can be standardized specifications designed for mainstream market die bonders, but also fully customized. All forms of epoxy nozzles can perfectly meet the quality control requirements for complete coverage and zero empty of silver colloid. Optimized design flow can also make the flow of the silver colloid stable and reliable.