1. Rubber Tip
We provide rubber tips for die bonder, the design of which considers the rubber material characteristics and the performance requirements for the tips in the production process of semiconductor industry, to meet customer requirements for the temperature resistance, abrasion resistance, and expansion coefficient pf the tips and to improve the back suction problems of the tips in use.










2. Ejector Needle
We provide all kinds of ejector needles, including metal ejector needles and metal-plastic combined plastic ejector needles with a variety of designs. In technical specifications we can not only provide standardized sizes to meet the mainstream market die bonders, but also accept customer customization.


3. Needle Cap
We can provide all kinds of needle caps for the mainstream equipment, and accept customer customization.

4. Wire/Ribbon Tube
We provide various sizes of wire tubes from the reel to the working parts. The material selected for the wire tubes has enough anti bending ability, so that when the wiring has a certain amount of tension, it can still maintain a relatively fixed shape and avoid serious quality problems such as unqualified arc and even cold solder joints. In the inner wall of the wire tubes there is a smooth coating, to ensure that the wire tubes cannot be scratched when the aluminum wires wire, and at the same time to ensure that the wire tubes not easy to dip aluminum.


5. Epoxy Nozzle
We provide various forms of epoxy nozzles according to the different equipment configuration and product requirements, including single needle, multi needle, multi holes and so on; the installation position can be standardized specifications designed for mainstream market die bonders, but also fully customized. All forms of epoxy nozzles can perfectly meet the quality control requirements for complete coverage and zero empty of silver colloid. Optimized design flow can also make the flow of the silver colloid stable and reliable.



