AUTOMATED AI BATCH WAFER EDGE INSPECTION
EMU Technologies Batch Wafer Edge Inspection system combines our Batch ID Reader and Cognex InSight ViDi AI Inspection system to provide an ultra high-throughput and extremely versatile wafer edge inspection solution.
The equipment performs a batch align and read cycle to read lasermarks and/or datamatrix tags on each wafer.
The equipment then rotates wafers using the batch aligner for edge defect inspection using a Cognex D905 camera.
An algorithm is trained to identify edge defects, which is deployed to the D905 camera as a job.
The machine can be connected to the host with SECS/GEM, providing a Pass/Fail result for each wafer in the Lot.
Defective wafer images are displayed on the user interface for analysis, if required.
With a typical cycle time of 3 minutes for a Batch ID Read and Batch Inspection, the machine can process up to 500wph with reading and
1500wph for edge inspection only.