Key Features:
1. High-resolution Optical Inspection for Pre and Post Die/Wire Bond Defects Detection
2. Real-time Data Analysis, Traceability and Reporting with SECGEM and Strip Map Functions
3. Optional Add-on SECS/GEM communication and SEMI Strip Map Feature
4. User-friendly Interface for Intuitive Operation
5. AI Integration Capability to Improve Detection Consistency and Reduce Human Assist
6. Detects Defects and Anomalies with High Accuracy Detection and Measurement
Benefits:
1. Increases Manufacturing Efficiency and Quality Control Effectiveness
2. Improve Process Yield by Identify Defects in the Earlier Stage of Backend Process
Availability
1. Worldwide Distribution
2. Highly responsive Technical Team for Support Locally and Oversea
3. Customizable Options for Specific Manufacturing Needs
4. Qualified AOI Supplier for Semiconductor IDMs and OSATs