Control Automation Technology Sdn Bhd

The system handles a wide range of tape sizes and accommodates both heat sealable and pressure-sensitive (PSA) tapes. Other advanced features include micro-stepper controlled tape drive, high-reliability optical sensors, touch screen operator panel, independent “floating” sealing shoes, fault condition display, and tool-less cover tape changeover.

Easy set-up, combined with rugged industrial-grade construction make the MT-35 the perfect solution for high-mix, small lot packaging situations in addition to meeting high-level production requirements.

The operator loads components into tape by hand or with the built-in vacuum wand while utilizing the footswitch to smoothly advance the tape. Optical sensing counts the parts to your pre-set value and ensures that every pocket in your production run is full.

The MT-35 Hi-Res micro stepper tape drive can operate in either continuous feed mode for standard manual loading — or in pocket indexing mode to accommodate a vision inspection camera for checking package orientation or other features.

FTI 1000 consists of independent test channels that allow all DC and AC power discrete parameters to be tested either separately, or in one handler insertion or prober touch-down.  DC test ranges to 200A and 5kV, AC tests include Single and Double Pulse Inductive Switching  (UIS, Eon/Eoff), Timing (ton/toff)  Gate Charge (Qg, Qgs, Qgd), Gate Resistance (Rg), Ciss/Coss/Crss, Delta Vsd and Short Circuit SOA.  FTI 1000 also targets Wide Band Gap applications such as Dynamic Rdson test for GaN HEMT, SiC UIS test to 4kV, including Diode Mode UIS and Half Bridge modules. 

FTI 2000 uses a ‘Tester per Channel Board’ design to test a wide range of Power IC’s with very low cost of test and high test floor scalability for multisite and multidie applications. FTI 2000 provides an innovative handler interface and docking solution for high test floor reliability with low cost of ownership.

Kaijo Corporation, a Japanese equipment manufacturing entity under the Shibuya Group, specializes in the production of Fully Automatic Wire Bonder machines. Our state-of-the-art equipment is designed to cater to your production requirements.

Since 1967, Kaijo has been a key player in the bonder business, persistently innovating its products to keep pace with the dynamic and challenging semiconductor and electronics industry. The most recent model of Kaijo’s wire bonders outperforms all its predecessors in terms of bonding speed and precision, promising to enhance your productivity and profitability.

To cater to our expanding clientele, Kaijo has established offices in various locations worldwide, including Malaysia, Taiwan, Thailand, China, Europe, and America.

COMPANY URL LINK

https://www.kaijo.co.jp/en.html

Unlike other tape forming systems that rely on the use of cardboard reels as the output method, the
Re-flex II forms carrier tape on demand, directly into the tape and reel process. Offering significant advantages over the traditional method of Carrier Tape management, the Re-flex II will:

· Save you money
· Eliminate lengthy material lead times
· Improve process
· Simplify inventory
· Reduce waste

Handling material widths from 8mm thru 88mm and with the capacity to form an almost infinite variety of pockets (including depths up to 30mm), the Re-flex II has the flexibility as the chosen solution for many market sectors including, but not limited to - Semi-conductors, Connectors, Metal-stamping...and with a visual inspection on every pocket coming as standard, QA is guaranteed.