MIS : Coreless Substrate; 1~6 Layers; 15/15 L/S; Any Shape &/or Any Size Photo Via; Wettable Flank; SMT Stud
FCBGA : Single Unit Core Substrate; 4-10 Layers; 15/15 L/S; Solder On Pad (SOP)
Electro-formed Substrate : Mushroom Structure For Ultra Thin PKG
Ceramic Substrate : High Thermal & High Voltage Applications Solution
COF : RTR Delivery, 1~2 Layers; High Precision Photo Imaged Etched Sprocket Holes; 15/20 L/S
FPC : Conventional Flex; Flex Assembly; Thin PCB; Rigid-Flex