Shenyang Heyan Technology Co.,Ltd

DS9260 is the full automatic model with 12 inches wafer dicing, the model realize whole automatic process from wafer loading, alignment, dicing, cleaning to unloading work, the machine equipped with high power dual spindle, both Z1 and Z2 axis spindles are installed with NCS and microscopes, largely reduced the alignment and manual checking time, so to save labor cost, and improve UPH

Features ：

1. Automatic dicing and cleaning
2. Built-in with NCS
3. Built-in with Kerf check
4. Optional BBD
5. Optional Shape recognition
6. Optional Data scanning input

Applications :

IC pakcage: QFN,DFN,BGA
Si wafer
LED package, EMC Substrate

Unique functions :

Brush + high pressure clean station can achieve good burr removal result for DFN/ QFN product

Muti-wafer cutting (4 inches wafer)

OCR vision wafer character recognition

Wafer edge trimming function

Build inside UV curing module

DS9260H is the full automatic model with8~ 12 inches wafer dicing, the model realize whole automatic process from wafer loading, alignment, dicing, cleaning to unloading work, the model can realize super thin wafer DBG process, and can realize wafer edge trimming, equipped with bernoulli wafer handler, and support two ways of wafer loading, wide application in the IC memory packaging.

Features :

1. Workpiece support 8~12’’
2. Wafer edge searching
3. Support half cut trimming 
4. Bernoulli wafer handler
5. Support Foup/Cassette two ways wafer loading
6. wafer notch detect, wafer positioning

Applications :

IC pakcage: QFN,DFN,BGA
Si wafer, IC, Memory wafer

HG5140 wafer grinder is a semi-automatic thinning machine with single grind spindle and single chuck, manual wafer loading/unloading, 
The machine is compatible with the thinning of 4/8inch wafers and features in compact design, small footprint, high reliability, can support 
mutiple wafers thinning at the same time, is suitable for processing resin material substrate and SiC, etc

Features :

.8.5KW high power, high rigidity spindle, low vibration, rotation speed range 1000-6000rpm
High precision thickness guage, measuring range of 0-4mm,with resolution 0.1um,Repeatablity: ±0.5um
IPC bus control mode, faster response time, more scalable ability
Min wafer thickness grind to 100um, back side TTV≤3um afer
grinding,Surface roughness Ra≤0.02um (#2000 grinding wheel)

HG5260 wafer grinder is a fully automatic thinning machine with two spindles and three chuck tables, automatic wafer pick, loading/unloading, equipped with a high rigidity air bearing grind spindle, a four-axis clean room robot arm, and a large-range high-resolution thickness gauge, etc. The machine is compatible with the thinning of 8/12inch wafers and realizes automatic wafer size switching without hardware replacement.

Features :

4.8KW high power, high rigidity spindle, low vibration, 
rotation speed range 1000-4000rpm 
High precision thickness guage, measuring range of 0-4mm, with resolution 0.1um,Repeatablity: ±0.5um
Min wafer thickness grind to 100um, back side TTV≤3um afer grinding,Surface roughness Ra≤0.02um (#2000 grinding wheel)
Automatic 4-axes wafer pick robot arm for clean room Strong two-fluid cleaning technology for wafer backside
Automatic adjustment of TTV on the grinded wafer surface