DELO Industrial Adhesives (Malaysia) SDN BHD

Kuala Lumpur,  Malaysia
https://www.delo-adhesives.com/

• Booth: 224

Overview

DELO is a leading manufacturer of high-tech adhesives and other multifunctional materials as well as adhesive dispensing and curing technology. Its products are mainly used in the automotive, consumer electronics, and semiconductor industries. They can be found in almost every mobile phone and in most cars worldwide, for example in cameras, loudspeakers, electric motors, or sensors. Customers include Bosch, Huawei, Mercedes-Benz, Osram, Siemens, and Sony.

  Press Releases

• New semicon adhesive propels autonomous driving forward (Apr 22, 2024)

  DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.

  The autonomous driving trend comes with ever-stricter safety requirements. Therefore, reliable components such as image sensors are installed in LiDAR and RADAR systems. Sensor housings on PCBs must be hermetically sealed throughout their entire service life in order to maintain their function permanently without interruption. However, previous solutions for hermetically sealing the housing and filter glass are reaching their limits due to these stricter requirements, failing to withstand the tests of the automotive industry, according to standard AEC-Q100.

  DELO has developed DELO DUALBOND BS3770, a special electronics adhesive for semiconductor manufacturers to meet the demanding reliability and qualification tests of automotive suppliers.

  Unlike adhesives previously available on the market, the newly developed adhesive is a flexible product with a Young's modulus of less than 5 MPa at room temperature. Due to its flexible properties starting from a temperature as low as approximately -50 °C, the adhesive can compensate for pressure changes that occur, such as those caused by temperature changes, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected.

  DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. After dispensing, the adhesive is fixed in a few seconds by means of classic light fixation. Alternatively, it can be transferred to the B-stage, which is particularly relevant for bonding filter glasses with blackprint. At this stage, it achieves an initial adhesion comparable to tape. Afterwards, the second component can be joined. Thanks to the adhesive’s initial adhesion, the component is directly fixed so that it can be entirely processed further. Final curing takes place in a convection oven at +150 °C within 40 minutes.

  In addition to image sensors for LiDAR and RADAR applications, DELO DUALBOND BS3770 is also used in driver monitoring and for 5G applications.

• New jet valve for maximum power and easy maintenance (Apr 22, 2024)

  DELO has launched a new high-performance microdispensing valve. DELO-DOT PN5 impresses with its wide range of applications and easy, tool-free maintenance of the fluid system. Its compact design allows for easy integration into production systems.

  The new pneumatic jet valve DELO-DOT PN5 can reproduce dispensing results at a continuous dispensing frequency of up to 300 Hz, even on difficult media. The plunger speed reaches twice the maximum value of its predecessor DELO-DOT PN3. The DELO-DOT PN5 offers a contactless application preventing collisions between the dispensing valve and the component. Even high-viscous materials can be dispensed accurately, precisely and reliably. The valve offers interchangeable nozzles with different diameters, as well as an adjustable plunger stroke that is flexible. This ensures that the application is reproducible using different drop sizes in the nanoliter range.

  The jet valve's plunger is made of hard materials such as ceramics and carbide and is suitable for prolonged use, even with complex materials. The actuator has a lifetime of more than one billion cycles. Compared to its predecessor, the new jet valve can be cleaned and maintained easily and efficiently because less parts come in contact with the adhesive. In addition, when the plunger wears out, for example at the end of its life cycle, only the nozzle and fluid plunger need to be replaced instead of the entire device. No special tools are required, since the fluid system can be easily removed via bayonet lock.  

  With its dimensions of 68 mm x 28 mm x 99.5 mm (W x D x H), the new jet valve can be integrated into process systems in a space-saving manner. The jet valve’s cartridge retainer, which can be positioned in 90° increments, allows media to be fed from all four sides of the device. This further simplifies fitting into production systems. The new and compact DELO-DRIVERBOX PN control unit is used in conjunction with the DELO-DOT PN5. The control unit is also designed to save space for use in PLC-operated systems. As a PLC alternative, DELO offers the powerful DELO-DOT pilot 1i cycle generator, which allows users to reliably generate the fastest dispensing cycles, regardless of their own PLC capabilities.

  Based on the standard model, DELO is planning further variants to meet the large demand for the most diverse media to be dispensed.

• Activation on the flow: New process technology for high-tech adhesives (Apr 22, 2024)

  With activation on the flow, DELO has developed an innovative process technology combining adhesive dispensing and preactivation in a single process step for the first time. This provides users with new options for designing their products and processes while reducing costs and CO2 emissions. The new technology is particularly suitable for bonding and encapsulating temperature-sensitive electronic components and offers an alternative to bonding processes previously used in industry.

  What is new about the so-called activation on the flow isthat the adhesive is already irradiated during the dispensing process, which starts the curing reaction even before the adhesive meets the component. After the combined process step, the components can be joined.

  Another special feature of the technology is that the exposed adhesive areas can be additionally irradiated and fixed after joining. This provides immediate initial strength, preventing the adhesive from flowing out and the components from slipping, which allows them to be further processed right away. Whether with or without additional light fixation: the adhesive cures reliably to final strength without any additional process step, even in undercuts and shadowed areas.

  The adhesives developed specifically for activation on the flow are one-component products based on epoxy resin. The patented DELO KATIOBOND FA adhesives contain two different initiators that react to different wavelengths and initiate curing. It is only thanks to this dual-initiator system that the optional light fixation step is possible. The adhesives are available with different mechanical properties and are highly resistant to media and temperature in the cured state.

  In addition to process technology and adhesives, DELO has also developed the appropriate device: DELO-ACTIVIS 600 consists of two subunits, one for dispensing and one for irradiation. Dispensing is done on a volumetric basis, with flow rate and quantity being defined according to process requirements. As the one-component adhesive passes through the mixing tube, it is irradiated via integrated DELOLUX 503 curing lamps. The mixing coil ensures uniform activation of the entire adhesive volume. DELO-ACTIVIS 600 can be used as a stand-alone device or integrated into existing production systems.

  “With activation on the flow, we have developed a complete system combining process technology, adhesive and device, which enables innovations on the customer side,” said Dr. Karl Bitzer, Head of Product Management at DELO. “The various customizable parameters open up completely new possibilities in terms of component design, efficient processes, and CO2 reduction.”

  Activation on the flow is particularly suitable for bonding and encapsulating temperature-sensitive components. For example, sensors or connectors can be bonded in a “gentle” way and with low stress using dual-initiator adhesives. None of the components need to be transmissive to light, and the adhesive cures reliably even in complex geometries.

  Activation on the flow can replace various bonding processes widely used in the industry. It is an efficient and environmentally friendly alternative for heat-curing, room-temperature-curing, or dual-curing processes, can overcome previous limitations, and creates room for innovation.

• DELO offers a new adhesive for closed-cavity packaging (May 14, 2024)

  DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems. Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. The electronics-specified adhesive can be dispensed in narrow, high bondlines, can compensate for temperature-dependent pressure changes, and meets routine automotive standards.

  The new adhesive was specially designed for the glass-on-die assembly method. The glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging.

  Compared to previous products, DELO DUALBOND EG6290 has a significantly higher Young's modulus of 2,350 MPa and significantly higher adhesion value. Due to a glass transition temperature (Tg) of over +130 °C, the adhesive exhibits mechanically consistent behavior—even at high application temperatures, for example, during the molding process—and can compensate for temperature-dependent pressure changes. DELO DUALBOND EG6290 thus fulfills the requirements of the AEC-Q100 Grade 2 automotive industry standard.  

  The adhesive is applied via needle dispensing. Thanks to its very high thixotropy index, narrow and high bondlines can be precisely dispensed, onto which the glass filter is then joined.

  Curing takes place in two successive process steps: First, the adhesive is exposed to light with a wavelength of 365 or 400 nm. Then, as a result, the glass filter is fixed within a few seconds. The adhesive typically fully cures in 15 minutes at +130 °C. Due to the rapid curing reaction, the matrix in the adhesive builds up quickly, which ensures the image sensor package is reliably sealed.

  Both the dual curing process and the comparatively low curing temperature help to minimize the pressure that usually occurs when bonding glass filters.

  CMOS image sensors are essential components in modern vehicles and are installed, for example, in LiDAR and driver monitoring systems. They must be completely sealed to keep out dust and moisture and maintain their safety functions over their entire service life.

  With this new product, DELO is expanding its portfolio of electronic adhesives, offering yet another solution for closed-cavity packaging in addition to adhesives for glass-on-housing applications.

  Products