DSK Technologies Pte Ltd

Package Dicing Tape

UV curable dicing tapes whose features can be changed in accordance with operational process. The tape’s strong adhesion secures Lead frame during dicing, and then is reduced by UV irradiation to facilitate pick-up.

Anti-static version is available.

Wafer Dicing Tape

It is designed for Blade Dicing and Laser Dicing Process. Wafer Dicing tape holds the dies together during the cutting process

Prevent chip fly-off and easy release after UV irradiation

Expandability for die separation

No residue on the die after pick up

Thermal Release Tape

Thermal release tape adheres tightly at normal temperature, yet can be peeled off effortlessly when necessary by heating it. With no residue left after removal, no clean-up is needed

Prevent Package deformation caused by wrinkle of the film

Prevent mold flashes during epoxy molding process

Prevent package destruction by static charge

Reduce damage due to low adhesion and easy release after molding

Wafer Back grinding Tape

Designed for Semiconductor Wafer. It has outstanding characteristics to support the back grind process of wafer manufacturing. Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding process.

• High Adhesion to wafer circuit surface and it reduces after UV irradiation

• Prevent water penetration during wafer back grinding process

• Reduce wafer warpage after Back grinding

• Low TTV after Back grinding

• No Ionic Impurities

Mold Release Tape

is used in Film assisted Molding Process (Fam).

The Film-Assisted Molding process uses one or two films in the mold. This film is sucked down into the inner surface of the mold before the lead frames and substrates are loaded.

Die Attach Film

Non-UV Daf application, semiconductor packaging companies can get a 1-step process(UV process) reducing benefit.

guarantees specification and actual test result performance. Pre-cut size can be adjusted depends on customer’s request.

Lead Frame Backside Tape

is used in molding process for QFN package.

Lead frame backside tape is a supporting tape used in map molding process of QFN. attaching on the reserve side of the lead frame, it has achieved no flash burr after molding.

• No mold flashes and bleeding after molding.

• No residue remained on lead frame after peeling

EMI Sputter Tape

Our EMI Carrier Tape proven in production environment, helps in reducing Sputtering cost and device thickness. Great shielding performance and excellent flexibility are achieved by using a sputtering method.

Detaping Tape

A special tape for removing back grinding tape. This tape, used in combination with Back Grinding equipment, allows the removal of back grinding tape without damaging the wafer.

Dicing Surfactant

It is designed specifically for the semiconductor industry,  surfactant additive mixed along with DI water to improve lubricity and cooling as well as removing particles and corrosion.

Additive surfactant to improve lubricity.

Features:

• Excel in cooling during the process of dicing.
• Reduces loads being excessively pushed onto saw blades
• Similar to that of detergent characteristics to sum up particles off wafers
• Effective into major improvement within wafer dicing.

Laser Grooving Coating/ Laser Grooving Solution

It is designed specifically for the laser cutting process. Perfectly suitable for laser cutting that improves the lubricity while improving of coolant created by cutting process.

Features:

• Reduces heating and burning during laser cutting.
• Decrease the sum up of particles from sticking as well as particle removal.
• To provide a coating protection of wafers.
• To provide debris free quality during the dicing process.
• A fully water soluble synthetic polymer.
• Completely suitable for laser cutting technology today.

Silicon Test Wafers

Silicon test wafer is commonly used in equipment testing whereby large quantities of wafers are needed for qualification runs. Contrary to the high-cost prime grade, test wafers are fabricated at lower cost with additional features customized in relation for each specific application. DSK Technologies assist in different standards of silicon test wafers for various applications.

Silicon Dummy Wafers

Silicon dummy wafers are used for experimental or testing projects. Of all different wafer grades, silicon dummy wafers are mostly used in the production line to evaluate the production process from measuring pressure resistance, film thickness, reflection index as well as safety related issues.

Available in all sizes:

2 inch, 3inch , 4inch, 5inch, 6inch, 8inch and 12inch

Product Features:

• Front side polished
• Double Side polished
• Different Thickness can be Customized

Monitor Wafers

Is used as a production device to Improve safety in the beginning of Production process and are use for delivery check and evaluation of process form.

Prime Wafers

Prime wafers are used for various applications such as photolithography, particle monitors, and other high tech projects.

Thin Wafers

Thin wafers have diameters of less than standard thickness. These sizes and thickness come vary depending on the specific application of the thin wafer.

Film Wafers

Film wafers have different characteristics due to different methods and are used for different purposes according to film type.

Oxide Wafers

The oxide is most commonly used as a dielectric layer and in MEMs devices.

Glass Wafers

We offer substrate wafers from various types of quartz, glass, alkaline free glass and glass-silicon compound materials.

Wafer Boats

Wafer boat supporting silicon wafers.

The wafer boat includes a ceramic body having at least one wafer support structure sized to support a silicon wafer.