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Advanced Dicing Technologies Ltd

Shanghai,  China
https://www.gltechadte.com/
  • Booth: 3805

Your ultimate Dicing and Grinding solutions provider.


  Products

  • 8320 12" Fully-automatic Dual Spindle Dicing Saw
    ADT 8230 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput.
    It is a high accuracy system that can dice product up to 12" in diameter, at high performances and low cost of operation....

  • Highest Dicing Process Speeds -  Lowest Cost

    Low vibration Air spindle

    Fast automatic alighnment and cut positionning for increased throughput

    Automatic Kerf check and quality analysis for maximum precision

    Process data logging and statistical analysis

  • 8220 8" Fully-automatic Dual Spindle Dicing Saw
    8220 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. 8220 is a high accuracy system that can dice product up to 8" in diameter, at high performances and low cost of operation....

    • The dicer has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users
    • The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories
    • The core components of the entire machine are independently controllable and are not affected by global economic and political changes
  • 6110 6" Single spindle automatic dicer
    6110 dicer is a high accuracy and high performance semi-automatic machine with single spindle. The width of the machine is only 490mm that make the footprint extremely small. It is low cost a operating system with a high-performance features....

    • Standard configuration includes a 2.2kW high-speed spindle (torque: 0.42N · m, maximum rotational speed: 60,000rpm)
    • Equipped with a 17-inch large-screen LCD touchscreen, featuring a user-friendly operating interface
    • The θ-axis is driven by a direct drive (DD) motor, providing high rotational precision and resolution
    • Fragment shape recognition feature
    • It is a highly practical equipment capable of precision cutting of silicon wafers, PCB boards, ceramics, and other materials
    • The equipment has a small footprint, which helps to save operating costs
  • 80WT Wettable Flank Dicing System (Half Cut)
    Designed for precise Shallow cut Wettable QFN dicing. The 80WT performs perfect grooving operation with constant depth of cut and groove shape, on an uneven surface of the substrate....

    • Confocal sensor
    • Loading up to 4 QFN magazinesTapeless process
    • Automatic loading 2 QFN panels (can support single panel)
    • Brush deburring
  • 6231 12" dual-spindle automatic dicer
    6231 dicer features a facing dual-spindle that can simultaneously dice wafers at high throughput. 6231 is a high-precision system that can dice product up to 12" in diameter with high performance....

    • The equipment has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users.
    • The core components of the entire machine are independently controllable and are not affected by global economic and political changes.
  • AR927 Water Recycling System
    This system is designed for circulating and supplying cutting water uniformly. It achieves this by filtering, cooling, and pumping water, and recycling the drainage to maintain the required purification, temperature, and flow rate....

    • Water recycling > Reducing consumption by 95%
    • Efficient cooling system > Lowering power consumption
    • Self-cleaning filter > Saving maintenance costs
    • Reducing environmental impact
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