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WEISUN INDUSTRIAL CO., LTD.

  • Booth: 3825

We sincerely invite you to attend our booth 3825.

Overview

WEISUN Industrial Co., Ltd., established in 1976, initially focused on OEM manufacturing for domestic drying equipment. Later, WEISUN transformed and developed its own brand as well as successfully opened the market.

After the financial turmoil in 2008, we decided to transform and create our own brand "WEISUN" emphasizes customized drying solutions for various processes. Overcoming challenges from diverse industries, including semiconductors and panels, we've shifted from 95% OEM to 100% Taiwan-made OBM manufacturer.

Our Products :

Industry 4.0 Automatic Drying Equipment
Clean Oxidation Free Drying Equipment
Standard Drying Equipment
Special Control Drying Equipment
Customized Conveyor Drying Equipment
Environmental Testing Drying Equipment
Preheat Drying Equipment
Multi-functional Software System


  Press Releases

  • Established in 1976, WEISUN upholds the business philosophy of "excellent quality, service first, and customer supremacy." With a continuous focus on the core technology of industrial drying process equipment, the company relentlessly pursues excellence and is dedicated to research and development through lean innovation, resulting in numerous patents and certifications. With the most efficient professional team, we provide customers with comprehensive and high-efficiency integration solutions of software and devices and planning to achieve fully automated operations, realizing the vision of an intelligent, green, and sustainable enterprise.

    Our AUTO Full-Automatic High-Temperature Dust-Free Oxygen-Free Oven, awarded the 2024 Taiwan Excellence Award, not only meets the demands of Industry 4.0 for automated unmanned factories but also strives to enhance energy efficiency and carbon reduction benefits. This product addresses occupational safety concerns, placing emphasis on clever design and advanced technology. It includes thoughtful features such as prominent warning lights, smoke detectors, high-temperature resistant painted glass, a touchscreen display, and an intuitive operating interface. Equipped with a surveillance camera system, it creates a safe and intelligent factory environment. Intelligent monitoring data can be directly uploaded and accessed in the central control system, realizing fully automated process management, including process instructions, handling, and relevant data during baking processes, facilitating easy management and traceability. Additionally, the solvent recovery design increases organic solvent recovery rates to 25%, effectively reducing the environmental impact of the manufacturing process.

    WEISUN will participate in SEMICON Southeast Asia 2024. We aim to expand our presence in the semiconductor, electronic equipment, and smart manufacturing system markets through this exhibition. We look forward to establishing closer partnerships with international industry partners for mutual benefits. During the exhibition, our professional sales representatives will engage in face-to-face discussions with visitors, sharing the latest trends in industrial drying equipment technology and successful application cases.

    WEISUN sincerely invites your presence, let's join hands in this grand occasion!

    Exhibition Information
    Location: Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, Malaysia
    Booth No.: 3825 (Taiwan Pavilion)
    Time: 
    5/28 (Tue.)9AM~5PM
    5/29 (Wed.)10AM~5PM
    5/30 (Thu.)10AM~4PM


    Media Contact:
    Name: Marketing Manager-Joanna Sung
    Email: [email protected]


  Products

  • AUTO High-Temperature Dust-Free Oxygen-Free Oven
    . The fully automated oven can be paired with EFEM or robotic arms, and relevant data can be directly uploaded to the server, achieving the goal of unmanned factory.
    . Built-in sensors.
    . Built-in motor drives.
    ...

  • Features

    Automation Control and IoT Integration
    • Built-in Sensors:To detect temperature, gas (O2 / N2) concentration, AGV battery capacity, positions of materials (Loader/Unloader/Ovens), and the status of automatic doors (open/close).
    • Built-in motor drives:Installing automatic switching motors and controllers for the oven, AGV (drive motors and stacking), and air flow control motors, each equipped with a networked PLC controller in both loader and oven. The connectivity between the loader and robotic arms is established through Wi-Fi.

    Applications

    Industries that necessitate automated production include semiconductor, IC, PCB, LED, and electronics manufacturing.

    PC/PLC Controlled Oven Specification

    Process Temperature RT ~450
    Temperature uniformity ± 1.5%
    Cleanliness Class 100
    Cooling Method Air Cooling(N2/CDA)、Water Cooling
    Compatible Equipment EFEM 、Robotic arm
    Oxygen Concentration 20ppm
    Operation Interface

    User-Friendly operation interface, complies with

    . CIM 

    . Ethernet & SECS/GEM

    . PCB ECI

     Options

    .  Fast air-cooling system

    .  Solvent recovery system

    .  Quick-detachable inner liner

    Process Curing for chips and substrates in PR/PI processes; ideal for wafer-level and fan-out panel level packaging,
    providing the optimal curing solution.

  • Top Down Flow Dust-Free and Oxygen-Free Oven
    .Exhaust Recovery
    .Transmission oven
    .Honored With the 32nd Taiwan Excellence Award
    .External Cooling System
    .External Temperature Uniformity
    .Adjustment Structure
    .New Dust-Free Design
    .Parts Early Warning system...

  • Features

    Exhaust Recovery
    • The product features a patented multi-layer air door for 99% airtightness and improved thermal insulation design of the machine, resulting in a 20-25% boost in energy efficiency. With a new water-cooling system, it achieves an average cooling efficiency of 4.5°C/minute, enhancing UPH ( units per hour ) output. The machine uses recyclable materials with a 60% recycling rate. Incorporating waste heat and solvent recovery, it reclaims 25% of organic solvents, reducing adhesion of organic substances to the chamber and maintenance time, ensuring high product yield, and contributing to energy savings. This approach also minimizes environmental pollution and workplace accidents.
    Parts Early Warning System
    • In the application field of the drying process in PCB (Printed Circuit Board) manufacturing, there is a increasing emphasis on environmental safety in machine design. Therefore, the oven is equipped with features such as video surveillance and remote configuration systems. It includes smoke detectors, a touch screen, and an intuitive user interface to enhance machine operational efficiency while reducing incidents in workplace.
    Achieve the Goal of Factory Automation
    • The product is compatible with AGV/RGV/MGV or robotic arms. In addition to the existing communication protocol, it incorporates IPC, touchscreen displays, and independent applications, enabling a complete integration of the human-machine interface. Relevant machine data that it follows PCB ECI regulation can be uploaded to servers, and it can be combined with intelligent cameras to provide clients with connectivity to a smart factory.
    Temperature Precision Control Technology
    • It allows real-time adjustments, ensuring temperature uniformity without the need for cooling.
    The Intelligent Throttling Module
    • By leveraging the automatic adjustment feature of the intelligent throttling module, nitrogen quantity can be controlled, resulting in significant savings of nitrogen while maintaining the predetermined oxygen content within the furnace, achieving oxygen-free drying.
    Automatic Door Design 
    • The doors feature an automatic door design, with the capability for independent control of the two chambers.
    Automation Control and IoT Integration
    • Built-in Sensors:To detect temperature, gas (O2 / N2) concentration, AGV battery capacity, positions of materials (Loader/Unloader/Ovens), and the status of automatic doors (open/close).
    • Built-in motor drives:Installing automatic switching motors and controllers for the oven, AGV (drive motors and stacking), and air flow control motors, each equipped with a networked PLC controller in both loader and oven. The connectivity between the loader and robotic arms is established through Wi-Fi.

    Applications

    Industries that necessitate automated production include semiconductor, IC, PCB, LED, and electronics manufacturing.

    PC/PLC Controlled Oven Specification

    Process Temperature RT ~450
    Temperature uniformity ± 1.5%
    Cleanliness Class 100
    Cooling Method Air Cooling(N2/CDA)、Water Cooling
    Compatible Equipment EFEM 、Robotic arm
    Oxygen Concentration 20ppm
    Operation Interface

    User-Friendly operation interface, complies with

    . CIM

    . Ethernet & SECS/GEM

    . PCB ECI

     Options

    .Fast air-cooling system

    Solvent recovery system

    Quick-detachable inner liner

    Process Curing for chips and substrates in PR/PI processes; ideal for wafer-level and fan-out panel level packaging,
    providing the optimal curing solution.

  • AGV Dust-Free Oxygen-Free Oxygen-Free Oven
    . Fully Automated Oven.
    . Compatible with automated/rail guided vehicles, as well as electric and manual trolley (MGV).
    . It can seamlessly upload relevant data directly to the server, realizing the vision of an unmanned and automated factory.
    ...

  • Features

    Key Technologies for Smart Automation
    • Automated oven system, seamlessly integrated with AGV and RGV, and featuring advanced carrier design for efficient material loading and unloading.
    • Implementing a range of sensors and controllers, seamlessly integrated with the control system interface through the Internet of Things (IoT).
    • Implementing CPS cyber-physical system to improve the utilization of production capacity and efficiency with smart software design.
    • Creating a database system, for electronic batch record and quality traceability.
    • Real-time integration with upstream and downstream processes for achieving unmanned operations and quality monitoring equipment.

    Application

    Various industries that require automated manufacturing, such as semiconductor, PCB, LED, electronics, etc.

    PC/PLC Controlled Oven Specification

    Process temparature RT ~300
    Temperature uniformity ± 1.5%
    Cleanliness Class 100
    Oxygen Content 1%
    Carrying Capacity Customizable
    Operation interface

    User-Friendly operation interface, complies with

    . CIM

    . Ethernet & SECS/GEM

    . PCB ECI

    Options

    . Fast air-cooling system

    . Solvent recovery system

    . Quick-detachable inner liner

    Process

    . PCB D/F

    . Lamination

    . Plug Hole

    . Solder Mask

    . SAP

    . Bumping

    . Panel Fan-out

    Compatible Equipment AGV/RGV/MGV
  • WOL Dust- Free Oven
    . A special rear door panel design that remains deformation-free.
    . Imported HEPA FILTER with a filtration efficiency of 99.97%, achieving Class 10 ~ 1000 cleanliness levels.
    . An enhanced level of airtightness.
    ...

  • Features

    • Featuring a special rear door panel design that remains deformation-free even under heating, significantly reducing heat dissipation. This innovation benefits the oven in terms of both temperature uniformity and energy efficiency.
    • Imported HEPA FILTER with a filtration efficiency of 99.97%, achieving Class 10 ~ 1000 cleanliness levels. The internal components and materials of the chamber are all designed for dust-free operation.
    • Featuring an enhanced level of airtightness, the chamber achieves a high cleanliness standard of Class 10 (according to U.S. Federal Standard FED-STD-209E, ISO TC/209, or ISO-14644-1).

    WEISUN employs a patented micro-dust filtering mechanism to effectively address the dust generation issue of HEPA FILTER during the temperature elevation and descent.

    Applications

    Industries that demand dust-free baking/drying environments include LCD, furnace tubes, wafer fabrication, light guide plates, IC manufacturing, transistors, diodes, LED production, backlight modules, and fixture curing.

    PC/PLC Controlled Oven Specification

    Model  Internal Dimension
    WxDxH cm
    External Dimension
    WxDxH cm
    Power Temperature Range Temperature Uniformity
    WOL-2 70x50x60 95x124x151 220V 3φ 60HZ 7.5KVA +60~300℃ Max. ±2~200℃
    ±4~300℃
    (No-Load)
    WOL-3 70x50x90 95x124x181 220V 3φ 60HZ 10.5KVA
    WOL-7 140x70x100 195x105.5x179 220V 3φ 60HZ 17KVA +60~200℃ Max.
    (Option 300℃ Max.)
    ±3~200℃
    (No-Load)
    WOL-8 150x70x160 198x123x254.5 220V 3φ 60HZ 26KVA
    Other Customization available
  • QWO Oxygen-Free Oven
    . Effectively saves 30% of nitrogen consumption.
    . With excellent airtightness, it can reduce the O2 to as low as 10 ppm.
    . Special Pressure Relief Design.
    ...

  • Features

    10ppm Oxygen-Free Key Technology
    • Special Pressure Relief Design: Utilizing an adjustable exhaust valve in conjunction with air intake control to maintain positive pressure inside the oven, ensuring a low-oxygen environment.
    • Enhanced air tightness is achieved at the tubular heater cable outlet through a unique hermetic seal design.
    • N2 Throttling Design - Segregating the supply conduit into two - main and auxiliary – and with automated flow regulation.
    • Cooling inter-layer design: a special indirect method to maintain an oxygen-free environment during cooling phase.
    • Inner door design - establishing an invisible barrier of nitrogen gas that not only prevents external gases from entering but also inhibits heat dissipation.
    • The inter-layer and the space between the inner and outer doors are filled with nitrogen (N2) to recover conducted waste heat for energy-saving.

    Applications

    IC packaging, wafer baking, film deposition and other industrial application.

    PC/PLC Controlled Oven Specification

    Model Internal Dimension
    WxDxH cm
    External Dimension
    WxDxH cm
    Power Temperature Range Temperature Uniformity
    QHWO-2 61x61x61 145x113x122 220V 3φ 60HZ
    9kvA/15kv
    +60~300℃ Max.
    +60~500℃ Max.
    300℃± 1.5%
    500℃± 2%
    QWO-2DS
    (Dual Chamber Type)
    71x61x56 146x96x180 220V 3φ 60HZ
         12kvA
    +60~250℃ Max.
    200℃± 1.5%
    (Empty Furnace No-Load)
    QWO-4D
    (Walk-In/Truck-In Type)
    71x61x91 138x90x140
  • High-Temperature Forced Convection Oven
    . Up to 20% energy savings, reliable, and durable.
    . Reinforced chamber, capable of preventing deformation.
    . Temperature Range : Ambient to 500°C; Custom options for 600°C available.
    ...

  • Features

    • Reinforced chamber, capable of preventing deformation caused by high temperatures, and relieving stress.
    • Special high-temperature-resistant separated speed control motor, durable and low vibration.
    • Specially treated motor shaft, no thermal deformation.
    • Imported high-temperature heating elements ensure minimal oxidation, zero electric leakage, and extended service life.
    • Temperature Range : Ambient to 500°C; Custom options for 600°C available.

    Applications

    In various industries requiring high-temperature baking, film deposition, and metal heat treatment—such as glass coating, age hardening, annealing, the MLCC sector, thermistors, and electronic filter applications.

    PC/PLC Controlled Oven Specification

    Model   Internal Dimension
    WxDxH cm
    External Dimension
    WxDxH cm
    Power Rack/Tray Door
    HWO-1 45x40x40 114x87x127 7KVA 4 1
    HWO-2 60x50x50 133x92x139 10KVA 5 1
    HWO-3 60x50x190 133x92x179 13KVA 9 1
    HWO-4 80x60x100 153x97x189 16KVA 10 1
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